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Elmet Technologies

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Hexcel® Redux® 322 Modified epoxy film adhesive (0.05 psf)
Categories: Polymer; Adhesive; Film; Thermoset; Epoxy; Epoxy Adhesive

Material Notes: Redux 322 is a high performance modified epoxy film adhesive curing at 350°F. It is suitable for bonding metal to metal and for sandwich structures, where operating temperatures are experienced up to 430°F for short periods, or 390°F for continuous operation. Redux 322 is a hot melt film which is free from solvents and consequently has a very low volatile content.

Features: Cure at 350°F; Good co-cure potential with 350°F curing prepregs; Good hot lap shear performance; Good high temperature performance in metal sandwich structures; Low volatile content and low out gassing properties; Available with or without a woven nylon carrier.
Applications: Metal to metal bonding; Sandwich constructions.

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Physical PropertiesOriginal ValueComments
Outgassing - Total Mass Loss 0.41 %Recovered Mass Loss (RML), Typical result; ESA PSS-01-702
 1.74 %Total Mass Loss (TML), Typical result; ESA PSS-01-702
Collected Volatile Condensable Material 0.00 %ESA PSS-01-702
 
Mechanical PropertiesOriginal ValueComments
Shear Strength 3.045 ksi
@Temperature 21.1 °C
Lap Shear
 3.045 ksi
@Temperature 149 °C
Lap Shear
 
Thermal PropertiesOriginal ValueComments
Maximum Service Temperature, Air 390 °F
 430 °F
 
Processing PropertiesOriginal ValueComments
Shelf Life 18.0 Month
@Temperature -17.8 °C
 
Descriptive Properties
Areal Weight (psf)0.05
Climbing Drum Peel (in-lb/3in)50.270°F; Based on prepreg skins and HexWeb® HRH10-3.2-64
Roll Width (in)21
Standard Roll (ft2)430
SupportWoven nylon carrier

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PHEXC445 / 99264

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