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Chemically Resistant adhesives

Lord Adhesives CoolTherm™ SC-305 Thermally Conductive Silicone Encapsulant
Categories: Polymer; Thermoset; Silicone; Silicone Elastomer, for Thermal Management

Material Notes:

All information provided by Lord.

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Physical PropertiesMetricEnglishComments
Specific Gravity 1.50 g/cc1.50 g/ccSC-305 Resin
 1.50 g/cc1.50 g/ccSC-305 Hardener
 1.50 g/cc1.50 g/ccMixed
Water Absorption <= 0.50 %<= 0.50 %cured
Viscosity  3500 cP
@Temperature 25.0 °C
3500 cP
@Temperature 77.0 °F
SC-305 Resin
 3500 cP
@Temperature 25.0 °C
3500 cP
@Temperature 77.0 °F
SC-305 Hardener
 3500 cP
@Temperature 25.0 °C
3500 cP
@Temperature 77.0 °F
Mixed
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore A 6060ASTM D 2240
Tensile Strength 1.48 MPa215 psicured
Elongation at Break 50 %50 %cured; ASTM D 412
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 3.30e+14 ohm-cm
@Temperature 25.0 °C
3.30e+14 ohm-cm
@Temperature 77.0 °F
cured; ASTM D 257
Dielectric Constant 3.2
@Frequency 1e+6 Hz,
Temperature 25.0 °C
3.2
@Frequency 1e+6 Hz,
Temperature 77.0 °F
cured; ASTM D 150
Dielectric Strength 19.7 kV/mm500 kV/incured
Dissipation Factor 0.0080
@Frequency 1e+6 Hz,
Temperature 25.0 °C
0.0080
@Frequency 1e+6 Hz,
Temperature 77.0 °F
cured; ASTM D 150
 
Thermal PropertiesMetricEnglishComments
CTE, linear 200 µm/m-°C111 µin/in-°Fcured; ASTM C 864
Thermal Conductivity 0.700 W/m-K4.86 BTU-in/hr-ft²-°FLaser Nano Flash Method, cured
Glass Transition Temp, Tg >= -100 °C>= -148 °Fcured
 
Processing PropertiesMetricEnglishComments
Working Life 30.0 min
@Temperature 25.0 °C
30.0 min
@Temperature 77.0 °F
Mixed
Gel Time 10.0 min
@Temperature 60.0 °C
10.0 min
@Temperature 140 °F
mixed, cured
Shelf Life 9.00 Month
@Temperature 25.0 °C
9.00 Month
@Temperature 77.0 °F
each component from date of manufacture
 
Descriptive Properties
AppearanceDark Grey LiquidSC-305 Hardener
 Grey LiquidMixed
 White LiquidSC-305 Resin

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PLORD9289 / 232645

Chemically Resistant adhesives

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