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Elmet Technologies

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Resinlab® EP324E Clear Two Part Epoxy Casting Resin
Categories: Polymer; Thermoset; Epoxy; Epoxy Cure Resin; Epoxy Encapsulant, Unreinforced

Material Notes: Resinlab™ EP 324E Clear is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wetting and adhesion to most surfaces and is free flowing to penetrate voids and give good air release and a smooth high gloss surface. It has very good resistance to water, acids and bases and most organic solvents. It was especially formulated to a 2A:1B volume mix ratio for use in side-by-side dispensing cartridges and meter/mix and dispense equipment. EP 324E Clear will reach full cure at room temperature within 24 hours. Cure time can be accelerated by the application of heat after product has gelled. Times and temperatures from 1 hour at 65°C to 20 minutes at 100°C are typical for small castings (less than 50 grams).

Information Provided by Resinlab L.L.C., an Ellsworth Adhesives Company.

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Physical PropertiesOriginal ValueComments
Specific Gravity 0.970 g/ccPart B
 1.04 g/ccMixed
 1.13 g/ccPart A
Viscosity 500 cPPart B
 2000 cPMixed
 3500 cPPart A
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 75 - 80
Tensile Strength, Yield 5000 psi
Elongation at Break 6.0 %
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 8.00e+14 ohm-cm
Dielectric Constant 4.2
@Frequency 100 Hz,
Temperature 25.0 °C
Dielectric Strength 410 V/mil
 
Thermal PropertiesOriginal ValueComments
CTE, linear 60.0 µm/m-°C
Thermal Conductivity 0.140 W/m-K
Maximum Service Temperature, Air 121 °C
Minimum Service Temperature, Air -40.0 °C
Glass Transition Temp, Tg 65.0 °C
 
Optical PropertiesOriginal ValueComments
Transmission, Visible 90 %clear; thickness not quantified
 
Processing PropertiesOriginal ValueComments
Pot Life 60 - 120 minMass: 100g
 
Descriptive Properties
ColorClear (amber)
Mix Ratio100:45Weight
 2:1Volume

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