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Master Bond adhesives

Bakelite® UP 804 Unsaturated Polyester Resin, High Surface Quality, UL Listed, Low Shrinkage, High Arc Resistance
Categories: Polymer; Thermoset; Filled/Reinforced Thermoset; Polyester, TS; Thermoset Polyester Glass Filled BMC

Material Notes: Polyester molding compound, inorganically filled, glass fiber reinforced, styrene free, high dimensional stability, very slight post shrinkage, good mechanical properties, non flammable, very good electrical properties, high temperature stability, UL list

Applications: Explosion proof switches, safety switch housings, electric motor clamp boards, wiring devices, housing parts, oven strips, oven knobs and regulator knobs, lamp parts.

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Density 2.10 g/cc0.0759 lb/in³ISO 1183
Apparent Bulk Density 0.920 g/cc0.0332 lb/in³ISO 60
Linear Mold Shrinkage 0.0015 cm/cm0.0015 in/inCompression Molding. Post Shrinkage = 0.02%.; ISO 2577
 
Mechanical PropertiesMetricEnglishComments
Ball Indentation Hardness 425 MPa61600 psiH961/30; ISO 2039/P1
Flexural Strength 105 MPa15200 psiISO 178
Flexural Modulus 14.5 GPa2100 ksiISO 178
Compressive Strength 165 MPa23900 psiISO 604
Charpy Impact Unnotched 0.700 J/cm²3.33 ft-lb/in²ISO 179-1 eU
Charpy Impact, Notched 0.400 J/cm²1.90 ft-lb/in²ISO 179-1eA
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 1.00e+13 ohm-cm1.00e+13 ohm-cm
Surface Resistance 1.00e+12 ohm1.00e+12 ohm
Dielectric Constant 6.0
@Frequency 100 Hz
6.0
@Frequency 100 Hz
Dielectric Strength 26.5 kV/mm
@Thickness 1.00 mm
673 kV/in
@Thickness 0.0394 in
IEC 60243-P1
Dissipation Factor 0.020
@Frequency 100 Hz
0.020
@Frequency 100 Hz
Arc Resistance 185 - 190 sec185 - 190 secASTM D495
High Voltage Arc Resistance to Ignition (HVAR)  >= 300 sec
@Thickness 1.40 mm
>= 300 sec
@Thickness 0.0551 in
(BK)
 >= 300 sec
@Thickness 1.50 mm
>= 300 sec
@Thickness 0.0591 in
(GY, BN, WT)
Comparative Tracking Index 600 V600 V
Hot Wire Ignition, HWI  >= 120 sec
@Thickness 1.40 mm
>= 120 sec
@Thickness 0.0551 in
(BK)
 >= 120 sec
@Thickness 1.50 mm
>= 120 sec
@Thickness 0.0591 in
(GY, BN, WT)
High Amp Arc Ignition, HAI  60 - 120 arcs
@Thickness 1.40 mm
60 - 120 arcs
@Thickness 0.0551 in
(BK)
 60 - 120 arcs
@Thickness 1.50 mm
60 - 120 arcs
@Thickness 0.0591 in
(GY, BN, WT)
 
Thermal PropertiesMetricEnglishComments
Maximum Service Temperature, Air 170 °C338 °F<20000 hours; IEC 60216-P1
 210 °C410 °F< 50 hours; IEC 60216-P1
Deflection Temperature at 8.0 MPa 205 °C401 °FISO 75-2
UL RTI, Electrical  105 °C
@Thickness 1.40 mm
221 °F
@Thickness 0.0551 in
(BK)
 105 °C
@Thickness 1.50 mm
221 °F
@Thickness 0.0591 in
(GY, BN, WT)
UL RTI, Mechanical with Impact  130 °C
@Thickness 1.40 mm
266 °F
@Thickness 0.0551 in
(BK)
 130 °C
@Thickness 1.50 mm
266 °F
@Thickness 0.0591 in
(GY, BN, WT)
UL RTI, Mechanical without Impact  130 °C
@Thickness 1.40 mm
266 °F
@Thickness 0.0551 in
(BK)
 130 °C
@Thickness 1.50 mm
266 °F
@Thickness 0.0591 in
(GY, BN, WT)
Flammability, UL94  V-1
@Thickness 1.50 mm
V-1
@Thickness 0.0591 in
WT
 V-0
@Thickness 1.40 mm
V-0
@Thickness 0.0551 in
BK
 V-0
@Thickness 1.50 mm
V-0
@Thickness 0.0591 in
BN,GY
 
Processing PropertiesMetricEnglishComments
Feed Temperature 60.0 - 70.0 °C140 - 158 °FInjection molding
Nozzle Temperature 70.0 - 100 °C158 - 212 °FInjection molding
Melt Temperature 70.0 - 100 °C158 - 212 °FInjection molding
Mold Temperature 160 - 180 °C320 - 356 °FInjection molding
 160 - 180 °C320 - 356 °FCompression molding
Injection Pressure >= 10.0 MPa>= 1450 psiCompression and injection cavity mold pressure
Back Pressure 0.500 - 1.00 MPa72.5 - 145 psiInjection molding
Cure Time 0.167 - 0.333 min0.00278 - 0.00556 hourPer 1 mm of wall thickness, injection molding
 0.333 - 0.667 min0.00556 - 0.0111 hourPer 1 mm of wall thickness, compression molding
 
Descriptive Properties
Creep Rupture StrengthGood
Holding PressureApproximately 40-60% of injection pressure
Media ResistanceMedium
Thermal ExpansionVery Slight
Water absorption (mg)1324h / 23°C

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PBAKE048 / 27082

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