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solder replacement adhesives

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In50-Sn50 Indium-Tin Solder
Categories: Metal; Nonferrous Metal; Indium Alloy; Solder/Braze Alloy

Material Notes: Characteristics:
  • Low Melt Temperature
  • Improved thermal fatigue properties when compared with Pb-Sn solders
  • Reduced gold scavenging
  • Wide temperature range allows for two- or three-step soldering

Applications:

  • Non-metallic
  • Multi-purpose soldering
  • Special Joining

Key Words: Glass-to-Metal Seal Alloy
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Physical PropertiesOriginal ValueComments
Specific Gravity 7.30 g/ccCalculated
 
Mechanical PropertiesOriginal ValueComments
Tensile Strength 11.9 MPa
Adhesive Bond Strength 11.2 MPa
 
Electrical PropertiesOriginal ValueComments
Electrical Resistivity 0.0000150 ohm-cm
 
Thermal PropertiesOriginal ValueComments
Thermal Conductivity 34.0 W/m-K
@Temperature 85.0 °C
Melting Point 118 - 125 °C
Solidus 118 °C
Liquidus 125 °C
 
Component Elements PropertiesOriginal ValueComments
Indium, In 50 %
Tin, Sn 50 %

References for this datasheet.

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MLIND910 / 135524

Solder Replacement
RoHS Compliant Adhesives for Solder Replacement
Master Bond offers RoHS compliant, electrically conductive systems to replace lead soldering. These epoxy and silicone adhesives offer low volume resistivity, low outgassing and high temperature resistance.

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