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Ensinger PEI

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Park Aerospace Nelco® N8000 Cyanate Ester Epoxy Laminate and Prepreg
Categories: Polymer; Thermoset; Epoxy

Material Notes: The Nelco N8000 is a high-Tg cyanate ester laminate and prepreg system that provides superior performance and product integrity and is ideal for board designs with higher layer counts, finer lines and spaces and larger panel sizes.

Key Features and Benefits:

  • High thermal performance
  • Self adhesive bond to foam cores
  • Superior electrical properties
  • Typical Cyanate Ester processing
  • S-glass and Quartz options

Applications:

  • Fine-Line Multilayers
  • Backplanes
  • Surface-Mount Multilayers
  • BGA Multilayers
  • MCM-L's
  • Direct Chip Attach
  • Automotive
  • Underhood Automotive
  • Wireless Communcations
  • High Speed Computing
  • Radomes and Secondary Aerospace Structure

Information provided by Park Electrochemical Corp.

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Density 1.73 g/cc50% resin content
Water Absorption <= 0.050 %IPC-TM-650.2.6.2.1
 
Mechanical PropertiesOriginal ValueComments
Modulus of Elasticity 3000 ksiX; ASTM D3039
 3000 ksiY; ASTM D3039
Poissons Ratio 0.14X; ASTM D3039
 0.14Y; ASTM D3039
Peel Strength 7.50 pli1 oz. Cu, at elevated temperature; IPC-TM-650.2.4.8.2a
 8.00 pli1 oz. Cu, after exposure to process solutions; IPC-TM-650.2.4.8
 8.00 pli1 oz. Cu, after solder float; IPC-TM-650.2.4.8
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 1.00e+13 ohm-cmC - 96/35/90; IPC-TM-650.2.5.17.1
 1.00e+13 ohm-cmE - 24/125; IPC-TM-650.2.5.17.1
Surface Resistance 1.00e+13 ohmC - 96/35/90; IPC-TM-650.2.5.17.1
 1.00e+13 ohmE - 24/125; IPC-TM-650.2.5.17.1
Dielectric Constant 3.5
@Frequency 1e+10 Hz
50% Resin Content; Stripline; IPC-TM-650.2.5.5.5
 3.6
@Frequency 1e+10 Hz
50% Resin Content; Split Post Cavity
 3.6
@Frequency 2.50e+9 Hz
50% Resin Content; Stripline; IPC-TM-650.2.5.5.5
 3.7
@Frequency 1e+9 Hz
50% Resin Content; RF Impedance; IPC-TM-650.2.5.5.9
Dielectric Strength 1650 V/milIPC-TM-650.2.5.6.2
Dielectric Breakdown >= 50000 VIPC-TM-650.2.5.6
Dissipation Factor 0.0070
@Frequency 1e+10 Hz
50% Resin Content; Split Post Cavity
 0.011
@Frequency 2.50e+9 Hz
50% Resin Content; Stripline; IPC-TM-650.2.5.5.5
 0.011
@Frequency 1e+10 Hz
50% Resin Content; Stripline; IPC-TM-650.2.5.5.5
Arc Resistance 160 secIPC-TM-650.2.5.1
 
Thermal PropertiesOriginal ValueComments
CTE, linear 6.11 - 7.22 µin/in-°F
@Temperature -40.0 - 125 °C
X/Y; IPC-TM-650.2.4.41
Glass Transition Temp, Tg 240 °CTMA; IPC-TM-650.2.4.24c
 250 °CDSC; IPC-TM-650.2.4.25c
 300 °CDMA (Tan d Peak); IPC-TM-650.2.4.24.3
Decomposition Temperature 376 °CTGA; 5% wt. loss; IPC-TM-650.2.4.24.6
 
Descriptive Properties
Methylene Chloride Resistance (% Weight Change)0.34IPC-TM-650.2.3.4.3
Pressure CookerPass60 min then solder dip @288°C until failure (max 10 min.); IPC-TM-650.2.6.16 (modified)
T260 (minutes)60+IPC-TM-650.2.4.24.1
T288 (minutes)30+IPC-TM-650.2.4.24.1
Z Axis Expansion (%)2.550-260°C; IPC-TM-650.2.4.41

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