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Master Bond adhesives

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Parker Chomerics Tecknit Teckfip™ FIP-N (LD) Formed in Place Conductive Elastomer
Categories: Polymer

Material Notes: FIP-N is similar in performance to FIP-A elastomer and hence offers a good non-corrosive EMI shield in harsh conditions. This material is a cost effective FIP compound.

Information provided by Chomerics

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Specific Gravity 2.975 - 4.025 g/cc
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore A 41 - 55
Tensile Strength >= 200 psi
Elongation at Break >= 50 %
Peel Strength >= 9.00 kN/m
Compression Set 10 - 25 %
 28 %
@Temperature 70.0 °C,
Time 79200 sec
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity <= 0.020 ohm-cm
Surface Resistance <= 0.020 ohm
 
Thermal PropertiesOriginal ValueComments
Maximum Service Temperature, Air 125 °C
Minimum Service Temperature, Air -55.0 °C
 
Processing PropertiesOriginal ValueComments
Cure Time <= 24.0 hour
Tack-Free Time >= 0.200 hour
Shelf Life 1.00 MonthSyringe
 6.00 MonthCartridge
 
Descriptive Properties
ColorPale Yellow
FillerSilver/Nickel

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PCHOME358 / 131068

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