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USP Class VI Adhesives
USP Class VI Approved Adhesives for Medical Device Applications
Master Bond’s biocompatible adhesives are designed to meet the needs of medical device manufacturers. Compounds withstand various types of sterilization methods.

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Mitsubishi Chemical Advanced Materials Sultron™ LSG PSU Extruded, Unfilled, Polysulfone
Categories: Polymer; Thermoplastic; Polysulfone (PSU)

Material Notes: Life Science Grade PSU stock shapes made from unfilled Udel™ PSU resin. Pre-assessed for biocompatibility on both resin and shape for up to 24 hours contact with body tissue according to USP VI and ISO 10993 and wetted contact in bioprocessing. Good hydrolysis resistance as well as great mechanical, thermal, and electrical properties.

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Physical PropertiesOriginal ValueComments
Specific Gravity 1.24 g/ccASTM D792
Water Absorption at Saturation 0.600 %ASTM D570 (17)
 
Mechanical PropertiesOriginal ValueComments
Hardness, Rockwell M 89.0ASTM D785
Hardness, Shore D 80.0ISO 868
Tensile Strength 88.0 MPaISO 527-1/-2 (7)
Elongation at Yield 5.00 %ISO 527-1/-2 (7)
Flexural Strength 120 MPaISO 178 (12)
Compressive Yield Strength 25.0 MPa
@Strain 1.00 %
ISO 604 (10)
 49.0 MPa
@Strain 2.00 %
ISO 604 (10)
 101 MPa
@Strain 5.00 %
ISO 604 (10)
Shear Strength 62.0 MPaASTM D732
Charpy Impact, Notched 3.50 kJ/m²ISO 179-1/1eA
 
Electrical PropertiesOriginal ValueComments
Surface Resistivity per Square 1.00e+14 ohmANSI/ESD STM 11.11
Dielectric Constant 3.14
@Frequency 1.00e+6 Hz
ASTM D150
Dielectric Strength 30.0 kV/mmIEC 60243-1 (15)
 425 kV/inASTM D149
Dissipation Factor 0.000800
@Frequency 1.00e+6 Hz
ASTM D150
 
Thermal PropertiesOriginal ValueComments
CTE, linear 31.0 µin/in-°FASTM E-831 (TMA)
 55.0 µm/m-°C
@Temperature 23.0 - 100 °C
 55.0 µm/m-°C
@Temperature 23.0 - 150 °C
 70.0 µm/m-°C
@Temperature >=150 °C
Thermal Conductivity 0.260 W/m-K
 1.80 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 300 °FContinuous Use Temperature in Air after 20000 hr
Deflection Temperature at 1.8 MPa (264 psi) 340 °FASTM D648
Minimum Service Temperature, Air -50.0 °C
Glass Transition Temp, Tg 374 °FDMA- Tan d
 
Compliance PropertiesOriginal ValueComments
USP Class VI Yes
 
Chemical Resistance PropertiesOriginal ValueComments
Acids, Strong (pH 1-3) Unacceptable
Acids, Weak Acceptable
Alcohols Acceptable
Alkalies, Strong (pH 11-14) Unacceptable
Alkalies, Weak Acceptable
Chlorinated Solvents Unacceptable
Continuous Sunlight Limited
Hot Water / Steam Limited
Hydrocarbons - Aliphatic Limited
Hydrocarbons - Aromatic Unacceptable
Inorganic Salt Solutions Acceptable
Ketones, Esters Unacceptable
 
Descriptive Properties
ESd categoryInsulative

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USP Class VI Adhesives
USP Class VI Approved Adhesives for Medical Device Applications
Master Bond’s biocompatible adhesives are designed to meet the needs of medical device manufacturers. Compounds withstand various types of sterilization methods.

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