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Master Bond adhesives

Copper Alloy, UNS C69240, HR02 Temper, Bar
Categories: Metal; Nonferrous Metal; Copper Alloy

Material Notes: Temper: 1/2 Hard and Stress Relieved

Fabrication Properties: Excellent Suitability – Soldering, Capacity for Being Hot Formed; Good Suitability – Brazing, Oxyacetylene Welding, Gas Shielded Arc Welding, Coated Metal Arc Welding, Spot Weld, Seam Weld, Butt Weld, Capacity for Being Cold Worked

Applicable Specifications: Rod – ASTM B371/B371M; Rod, Bar & Shapes – Forgings ASTM B124/B124M

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Physical PropertiesMetricEnglishComments
Density 8.33 g/cc0.301 lb/in³
 
Mechanical PropertiesMetricEnglishComments
Hardness, Rockwell B 7070
Tensile Strength 517 MPa75000 psi
Tensile Strength, Yield 372 MPa54000 psi0.2% Offset
Elongation at Break 29 %29 %
Tensile Modulus 103 GPa15000 ksi
Modulus of Rigidity 39.18 GPa5682 ksiCalculated
Poissons Ratio 0.320.32
Machinability 75 %75 %
Forgeability 95 %95 %
 
Electrical PropertiesMetricEnglishComments
Electrical Resistivity 0.0000190 ohm-cm0.0000190 ohm-cm9% IACS
 
Thermal PropertiesMetricEnglishComments
CTE, linear 18.7 µm/m-°C
@Temperature 20.0 - 300 °C
10.4 µin/in-°F
@Temperature 68.0 - 572 °F
Thermal Conductivity 2.59 W/m-K18.0 BTU-in/hr-ft²-°F
Melting Point 870.0 - 877 °C1598 - 1610 °F
Solidus 870.0 °C1598 °F
Liquidus 877 °C1610 °F
 
Component Elements PropertiesMetricEnglishComments
Copper, Cu 71 - 72.5 %71 - 72.5 %
Iron, Fe <= 0.20 %<= 0.20 %
Lead, Pb <= 0.25 %<= 0.25 %
Manganese, Mn 0.60 - 1.2 %0.60 - 1.2 %
Nickel, Ni 0.10 - 0.50 %0.10 - 0.50 %
Phosphorus, P 0.060 - 0.12 %0.060 - 0.12 %
Silicon, Si 1.8 - 2.2 %1.8 - 2.2 %
Tin, Sn <= 0.30 %<= 0.30 %
Zinc, Zn 22.9 - 26.4 %22.9 - 26.4 %As Balance

References for this datasheet.

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MC69240x2 / 292366

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