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Master Bond adhesives

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Asahi Kasei Leona™ CR302 Polyamide 66, MF Reinforced
Categories: Polymer; Thermoplastic; Nylon (Polyamide PA); Nylon 66 (PA66)

Material Notes: Improved soldering heat resistance. Low abrasion and superior electrical properties.

Applications:Sliding switch insulators

Information provided by Asahi Kasei Corp.

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Specific Gravity 1.52 g/ccDry as Molded; ASTM D792
Density 1.52 g/ccDry as Molded; ISO 1183
Moisture Absorption at Equilibrium 1.4 %
@Temperature 23.0 °C
50% RH; ISO 62
 1.4 %
@Temperature 23.0 °C
50% RH
Linear Mold Shrinkage, Flow 0.0050 - 0.010 cm/cmAsahi Kasei
 
Mechanical PropertiesOriginal ValueComments
Hardness, Rockwell M 90Dry as Molded; ISO 2039
Tensile Strength at Break 92.0 MPaConditioned at 50% RH; ISO 527
 140 MPaDry as Molded; ISO 527
Tensile Strength 98.0 MPaConditioned at 50% RH; ASTM D638
 128 MPaDry as Molded; ASTM D638
Elongation at Break 2.0 %Dry as Molded; ISO 527
 2.5 %Conditioned at 50% RH; ISO 527
Tensile Modulus 7600 MPaConditioned at 50% RH; ISO 527
 10000 MPaDry as Molded; ISO 527
Flexural Strength 148 MPaConditioned at 50% RH; ISO 178
 197 MPaDry as Molded; ISO 178
Flexural Modulus 7100 MPaConditioned at 50% RH; ISO 178
 9800 MPaDry as Molded; ISO 178
Izod Impact, Notched 36.0 J/mDry as Molded; ASTM D256
 39.0 J/mConditioned at 50% RH; ASTM D256
Charpy Impact Unnotched 38.0 kJ/m²Dry as Molded; ISO 179
 46.0 kJ/m²Conditioned at 50% RH; ISO 179
Charpy Impact, Notched 4.00 kJ/m²Dry as Molded; ISO 179
 5.00 kJ/m²Conditioned at 50% RH; ISO 179
 
Thermal PropertiesOriginal ValueComments
Deflection Temperature at 0.46 MPa (66 psi) 260 °CDry as Molded; ISO 75
Deflection Temperature at 1.8 MPa (264 psi) 247 °CDry as Molded; ISO 75
Flammability, UL94 HB
@Thickness 0.750 mm
Dry as Molded

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PASAHI8152 / 221179

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