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Solvay CYFORM® 777 Epoxy Tooling Prepreg
Categories: Polymer; Thermoset; Epoxy

Material Notes: Description: CYFORM 777 is a proven, high-performance and cost-effective, low-temperature-curing epoxy tooling system available with either carbon or glass reinforcement. CYFORM 777 allows high-quality tooling laminates to be produced directly from a low-temperature master model. After vacuum bag/oven or autoclave processing for the initial cure, the tool laminate can be de-molded and post-cured “free-standing”. CYFORM 777 is supplied in roll form with a standard roll length of 25 yards (25 meters). Standard material width is 50 inches (1000 – 1270mm). Materials are shipped frozen and in insulated boxes.

Features & Benefits:

  • Provides versatile low temperature curing options from 48 hours at 122°F (50°C) to 3 hours at 194°F (90°C)
  • Manufactured to ensure uniform resin distribution in fabrics with <1% volatile content
  • Formulated for long term thermal oxidative stability during normal 350°F (177°C) service
  • Exhibits low and predictable shrinkage with both carbon and glass fiber reinforcement
  • Closely matches the thermal expansion coefficient of composite parts reducing dimensional inaccuracies and residual stress levels
  • When used with a surface gel-coat, produces tools of extremely low void content via vacuum-bag-only processing if autoclave facilities are not available
  • Determined safe to use via extensive toxicological screening (contains no MDA or VCHDs)
Suggested Applications:
  • Tools used for manufacture of composite components where a balance of working time and low temperature cure capability is required

Information provided by Cytec, subsequently acquired by Solvay.

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Physical PropertiesOriginal ValueComments
Volatiles <= 1.0 %Carbon
 <= 1.0 %Glass
 
Mechanical PropertiesOriginal ValueComments
Flexural Modulus 16.0 GPa
@Temperature 177 °C
GPT, After post-cure
 17.0 GPa
@Temperature 177 °C
GPT, After thermal cycling
 23.0 GPa
@Temperature 90.0 °C
GPT, After post-cure
 25.0 GPa
@Temperature 20.0 °C
GPT, After thermal cycling
 26.0 GPa
@Temperature 20.0 °C
GPT, After post-cure
 35.0 GPa
@Temperature 177 °C
CP200, After thermal cycling
 38.0 GPa
@Temperature 177 °C
CP200, After post-cure
 41.0 GPa
@Temperature 20.0 °C
CP200, After thermal cycling
 45.0 GPa
@Temperature 90.0 °C
CP200, After post-cure
 46.0 GPa
@Temperature 20.0 °C
CP200, After post-cure
 
Thermal PropertiesOriginal ValueComments
CTE, linear 2.50 µm/m-°CCarbon
 14.6 µm/m-°CGlass
Maximum Service Temperature, Air 177 °Clong-term
Glass Transition Temp, Tg 196 °CCarbon
 196 °CGlass
Shrinkage 0.031 %Carbon
 0.15 %Glass
 
Processing PropertiesOriginal ValueComments
Gel Time 12.0 min
@Temperature 60.0 °C
Carbon
 12.0 min
@Temperature 60.0 °C
Glass
 24.0 min
@Temperature 100 °C
Carbon
 24.0 min
@Temperature 100 °C
Glass
Shelf Life 12.0 Month
@Temperature -18.0 °C
Carbon
 12.0 Month
@Temperature -18.0 °C
Glass

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