Honeywell TGP8000 Thermal Gap Pads

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Honeywell TGP8000 Thermal Gap Pads
Categories:	Other Engineering Material
Material Notes:	Benefits And Features: High thermal performance Ultra-high compressibility for low stress applications Excellent surface wetting for low contact resistance High reliability Electrically insulating Overview: Honeywell Thermal Gap Pads (TGP) provide high thermal performance with ease of use across multitude of applications. Its ultra-high compressibility enables low stress and excellent conformity to mating surfaces. It is designed to minimize thermal resistance at interfaces, and maintain excellent performance through reliability testing. Honeywell TGP models are naturally tacky, and require no additional adhesive which could inhibit thermal performance. Products are available in thickness range from 0.5mm to 5.0mm. Typical Applications: Consumer electronics Telecommunications & network servers Automotive electronics Power devices & modules Semiconductors logics & memory Information provided by Honeywell
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Physical Properties	Original Value	Comments

Specific Gravity	3.40 g/cc	ASTM D792

Mechanical Properties	Original Value	Comments
Hardness, Shore OO	30	ASTM D2240

Electrical Properties	Original Value	Comments
Volume Resistivity	6.50e+15 ohm-cm	ASTM D257
Dielectric Constant	>= 8.3 @Frequency 1e+6 Hz	ASTM D150

Thermal Properties	Original Value	Comments
Thermal Conductivity	8.00 W/m-K	ASTM D5470
Flammability, UL94	V-0

Processing Properties	Original Value	Comments
Shelf Life	12.0 Month

Descriptive Properties
Color	Grey
Thickness Range (mm)2	0.5-5	ASTM D374

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