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Master Bond adhesives

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Denka ME ABS Polymer
Categories: Polymer; Thermoplastic; ABS Polymer; Acrylonitrile Butadiene Styrene (ABS), Plating Grade

Material Notes: Plating Grade. Used in a wide range of applications, including toys, home articles, home electric appliances, OA equipment, exterior and interior automotive parts, etc.

Information provided by Denka Company Limited.

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Density 1.04 g/ccISO 1183
 1.04 g/ccASTM D-792
Linear Mold Shrinkage 0.0040 - 0.0060 cm/cm
@Thickness 2.00 mm
DENKA Method
Melt Flow 12 g/10 min
@Load 9.99 kg,
Temperature 220 °C
ISO 1133
 
Mechanical PropertiesOriginal ValueComments
Hardness, Rockwell R 108ISO 2039-2
 116ASTM D-785
Tensile Strength at Break 34.0 MPa50 mm/min; ISO 527-1,-2
 44.0 MPa5 mm/min; ASTM D-638
Tensile Strength, Yield 46.0 MPa50 mm/min; ISO 527-1,-2
Tensile Modulus 2500 MPa1 mm/min; ISO 527-1, -2
Flexural Strength 72.0 MPa15 mm/min; ASTM D-790
 75.0 MPa2 mm/min; ISO 178
Flexural Modulus 2400 MPa2 mm/min; ISO 178
 2400 MPa15 mm/min; ASTM D-790
Izod Impact, Notched 242 J/mASTM D-256
Charpy Impact, Notched 24.0 kJ/m²ISO 179
 
Electrical PropertiesOriginal ValueComments
Surface Resistance >= 1.00e+16 ohm50% RH; JIS K 6911
 
Thermal PropertiesOriginal ValueComments
Deflection Temperature at 1.8 MPa (264 psi) 79.0 °CFlatwise; ISO 75-1, -2
 88.0 °CEdgewise; ASTM D-648
Vicat Softening Point 98.0 °C
@Load 5.10 kg
ASTM D-1525
 100 °C
@Load 5.10 kg
ISO 306
Flammability, UL94 HB
 
Processing PropertiesOriginal ValueComments
Processing Temperature 180 - 200 °CCylinder 1
 200 - 230 °CCylinder 2
 210 - 260 °CCylinder 3
Nozzle Temperature 210 - 255 °C
Mold Temperature 40.0 - 60.0 °C
Drying Temperature 80.0 - 85.0 °C
@Time 7200 - 10800 sec
Back Pressure 71.1 - 142 psi
Screw Speed 80 - 120 rpm

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PDENJ812 / 250156

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