Epoxies, Etc 20-1640 Silicone Potting and Encapsulating Compound

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Epoxies, Etc 20-1640 Silicone Potting and Encapsulating Compound
Categories:	Polymer; Thermoset; Silicone
Material Notes:	Description: 20-1640 is a two component silicone elastomer. When cured, this material forms a soft and highly flexible electrically insulating package. 20-1640 can be used for potting or encapsulating electronic packages that have sensitive components. Due to its low stress during and after cure, this material will not crush or damage delicate components. 20-1640 is formulated without solvents or other toxic materials. It is therefore not regulated or considered hazardous for transportation. Features: Flexible Deep section curing (beyond 1-2 inches) Solvent free High operating temperatures Benefits: Low stress on components and vibration resistant No need for multiple pours due to low exotherm Good protection in extreme environmental applications No by-products released during cure and safe to handle Information provided by Epoxies, Etc
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Physical Properties	Original Value	Comments

Specific Gravity	0.970 g/cc	Activator (Part B)
	1.54 g/cc	Mixed
	1.60 g/cc	Resin (Part A)
Viscosity	100 cP	Activator (Part B)
	50000 cP	Mixed
	150000 cP	Resin (Part A)
Storage Temperature	18.0 - 27.0 °C

Mechanical Properties	Original Value	Comments
Hardness, Shore A	34
Tensile Strength	175 psi
Elongation at Break	430 %
Tear Strength	18.5 pli

Electrical Properties	Original Value	Comments
Volume Resistivity	1.00e+14 ohm-cm
Dielectric Constant	3.1 @Frequency 100 Hz
Dielectric Strength	450 V/mil

Thermal Properties	Original Value	Comments
CTE, linear	200 µm/m-°C
Thermal Conductivity	1.10 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air	235 °C
Minimum Service Temperature, Air	-65.0 °C

Processing Properties	Original Value	Comments
Pot Life	60.0 min @Load 0.100 kg
Shelf Life	6.00 Month

Descriptive Properties
Color	Clear	Activator (Part B)
	White	Resin (Part A)

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PFEPOX003 / 316680

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