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Master Bond adhesives

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Elantas EN-2534 (Conap) Potting and Encapsulation Adhesive
Categories: Polymer; Adhesive; Thermoset; Polyurethane, TS; Thermoset Polyurethane, Adhesive

Material Notes:
Polyurethane Potting and Encapsulating Systems
Conathane® EN-2500 series polyurethane potting and encapsulating systems from Cytek have varying degrees of worklife, viscosity and hardness for many specific potting and encapsulating applications such as modules, strain-sensitive components, transformers, and coils. All 2500 series systems exhibit excellent performance when exposed to adverse environments and temperature ranges between -55°C and +130°C.

Cytec (Conap) EN-2534 Potting and Encapsulation Adhesive

  • Passes Thermal Shock Test (10 Cycles, -65°C to 130°C)
  • Non-Nutrient Fungus Resistance (MIL-STD-810B)
  • Mix Ratio: 20/100 (by Weight)

Information provided by Cytec, subsequently acquired by Elantas.

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Physical PropertiesOriginal ValueComments
Density 1.45 g/ccCured
Water Absorption 0.15 %24 hours
Water Absorption at Saturation 0.0045 %30 Days
Viscosity 2200 cP
@Temperature 25.0 °C
Linear Mold Shrinkage 0.0065 cm/cm
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 50 - 55
Tensile Strength, Ultimate 1970 psi
Elongation at Break 60 %
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity <= 3.40e+13 ohm-cm
Surface Resistance 1.50e+13 ohm
Dielectric Constant 4.1
@Frequency 1000 Hz
Dielectric Strength 584 V/mil
@Thickness 1.59 mm
Dissipation Factor 0.049
@Frequency 1000 Hz
Arc Resistance >= 120 sec
 
Thermal PropertiesOriginal ValueComments
CTE, linear 150 µm/m-°C
@Temperature 20.0 °C
Thermal Conductivity 0.000450 cal cm/sec-cm²-°C
Maximum Service Temperature, Air 130 °C
Minimum Service Temperature, Air -55.0 °C
 
Processing PropertiesOriginal ValueComments
Cure Time 2.00 hour
@Temperature 100 °C
 16.0 hour
@Temperature 80.0 °C
 10080 min
@Temperature 25.0 °C
Pot Life 15.0 - 20.0 min
@Temperature 25.0 °C
1 lbm
 
Descriptive Properties
ColorBlack

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PCYTEC22 / 29254

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