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Mitsubishi Reny® 1022H Polyamide
Categories: Polymer; Thermoplastic; Nylon (Polyamide PA); Nylon 6 (PA6)

Material Notes: 50% glass fiber mineral reinforced. General grade. High Performance Polyamide. Reny is a proprietary molding compound based on mainly polyamide MXD6 that has been reinforced with glass fiber, carbon fiber or special minerals. Reny generally has superior mechanical strength and modulus compared with other engineering plastics. Thus, Reny is suitable as a metal substitute in many applications, including automobiles, electronics, electrical appliances, machinery, and construction. Excellent mechanical strength and modulus over a wide range of temperatures. Superior to commodity polyamides in dimensional stability and mechanical strength due to low water absorption. Low thermal expansion coefficient, equivalent to that of metal alloys. Highly resistant to oils and organic solvents. Low mold shrinkage and low warpage. Good surface finish even in highly filled grades.

Information provided by Mitsubishi Engineering Plastics Corporation.

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Physical PropertiesOriginal ValueComments
Density 1.65 g/ccISO 1183
Water Absorption 1.1 %
@Temperature 23.0 °C
Immersion
Moisture Absorption 0.140 %
@Temperature 23.0 °C
50% RH
Linear Mold Shrinkage 0.0040 cm/cm
Melt Flow 8.3 g/10 min
@Load 2.16 kg,
Temperature 275 °C
ISO 1133
 
Mechanical PropertiesOriginal ValueComments
Tensile Strength at Break 214 MPa50% RH; ISO 527-1,2
 260 MPadry; ISO 527-1,2
Elongation at Break 2.0 %dry; ISO 527-1,2
 2.1 %50% RH; ISO 527-1,2
Tensile Modulus 19300 MPa50% RH; ISO 527-1,2
 20400 MPadry; ISO 527-1,2
Flexural Strength 318 MPa50% RH; ISO 178
 390 MPadry; ISO 178
Flexural Modulus 15100 MPa50% RH; ISO 178
 18400 MPadry; ISO 178
Charpy Impact Unnotched 58.0 kJ/m²50% RH; ISO 179-1, 179-2
 72.0 kJ/m²dry; ISO 179-1, 179-2
Charpy Impact, Notched 11.3 kJ/m²dry; ISO 179-1, 179-2
 12.2 kJ/m²50% RH; ISO 179-1, 179-2
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 1.00e+15 ohm-cm50% RH; IEC 60093
 2.00e+16 ohm-cmdry; IEC 60093
Surface Resistance 8.00e+14 ohm50% RH; IEC 60093
 1.00e+16 ohmdry; IEC 60093
Dielectric Constant 5.0
@Frequency 100 Hz
50% RH; IEC 60250
 5.0
@Frequency 1e+6 Hz
50% RH; IEC 60250
 5.0
@Frequency 100 Hz
dry; IEC 60250
 5.0
@Frequency 1e+6 Hz
dry; IEC 60250
Dielectric Strength 25.0 kV/mm
@Thickness 1.00 mm
50% RH; IEC 60243-1
 27.0 kV/mm
@Thickness 1.00 mm
dry; IEC 60243-1
Dissipation Factor 0.0070
@Frequency 100 Hz
dry; IEC 60250
 0.0080
@Frequency 1e+6 Hz
dry; IEC 60250
 0.017
@Frequency 1e+6 Hz
50% RH; IEC 60250
 0.020
@Frequency 100 Hz
50% RH; IEC 60250
Comparative Tracking Index 550 V50% RH; IEC 60112
 575 Vdry; IEC 60112
 
Thermal PropertiesOriginal ValueComments
CTE, linear, Parallel to Flow 10.0 µm/m-°CISO 11359-2
CTE, linear, Transverse to Flow 40.0 µm/m-°CISO 11359-2
Deflection Temperature at 0.46 MPa (66 psi) 233 °C50% RH; ISO 75-1,2
 238 °Cdry; ISO 75-1,2
Deflection Temperature at 1.8 MPa (264 psi) 223 °C50% RH; ISO 75-1,2
 230 °Cdry; ISO 75-1,2
Flammability, UL94 HB
@Thickness 1.60 mm
 
Processing PropertiesOriginal ValueComments
Rear Barrel Temperature 280 °C
Middle Barrel Temperature 275 °C
Front Barrel Temperature 270 °C
Nozzle Temperature 280 °C
Mold Temperature 120 - 140 °C
Injection Pressure 20.0 - 150 MPa
Screw Speed 60 - 150 rpm

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