High reliability and high temperature material 35N is a pure polyimide laminate and prepreg system for applications requiring high temperature performance. High Tg results in low Z-direction expansion for resistance to PTH failure during PWB processing, and minimizes risk of latent PTH defects in service. Reduced temperature and time to cure offers improved throughput compared to traditional polyimide cycles. - Low Z-expansion minimizes the risk of PTH defects caused during solder reflow and device attachment
- Electrical and mechanical properties meeting the requirements of IPC-4101/40 and /41
- Toughened. Non-MDA chemistry resists drill cracking
- Compatible with lead-free processing
- RoHS/WEEE compliant
Typical Applications: - PCBs that are subjected to high temperatures during processing, such as lead-free soldering
- Applications with significant lifetimes at high temperatures, such as aircraft engine instrumentation, down hole drilling, under-hood automotive controls, burn-in boards, or industrial sensors.
Information provided by ARLON Electronic Materials. |