Chase Electronic Coatings HumiSeal® 1B66 Acrylic Conformal Coating

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Chase Electronic Coatings HumiSeal® 1B66 Acrylic Conformal Coating
Categories:	Polymer; Thermoset
Material Notes:	HumiSeal® 1B66 is a fast drying, single component, acrylic conformal coating that provides excellent moisture and environmental protection for printed circuit assemblies. HumiSeal® 1B66 demonstrates outstanding flexibility and is easily repaired. HumiSeal® 1B66 coating is RoHS Directive 2002/95/EC compliant. Information provided by Chase Electronic Coatings.
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Physical Properties	Original Value	Comments

Density	0.910 g/cc	ASTM D1475
Solids Content	35 %	± 3%. By weight; Fed-Std-141, Meth. 4044
Volatile Organic Compounds (VOC) Content	592 g/l
Viscosity	185 - 215 cP	Fed-Std-141, Meth. 4287
Thickness	25.0 - 75.0 microns	Recommended coating

Mechanical Properties	Original Value	Comments
Modulus of Elasticity	0.850 GPa @Temperature 40.0 °C	DMA

Electrical Properties	Original Value	Comments
Insulation Resistance	6.00e+9 ohm	Moisture; MIL-I-46058C
	8.00e+14 ohm	MIL-I-46058C
Dielectric Constant	2.5 @Frequency 1e+6 Hz, Temperature 25.0 °C	ASTM D150-98
Dielectric Breakdown	7500 V	ASTM D149
Dissipation Factor	0.010 @Frequency 1e+6 Hz, Temperature 25.0 °C	ASTM D150-98

Thermal Properties	Original Value	Comments
CTE, linear	175 µm/m-°C @Temperature <=14.0 °C	Below Tg; TMA
	345 µm/m-°C @Temperature >=14.0 °C	Above Tg; TMA
Glass Transition Temp, Tg	14.0 °C	DSC

Processing Properties	Original Value	Comments
Cure Time	0.500 hour @Temperature 76.0 °C	Option
	24.0 hour @Temperature 23.0 °C	Option
	168 hour @Temperature 23.0 °C	Optimum Properties
Tack-Free Time	0.170 hour	To handle; Fed-Std-141, Meth. 4061
Shelf Life	24.0 Month @Temperature 23.0 °C	DOM

Descriptive Properties
Dielectric Withstand	>1500 V	per MIL_I_46058C
Fungus Resistance	Passes	ASTM G21
Thermal Shock	-65 to 125°C	per MIL_I_46058C, 50 cycles

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PCHAS907 / 239768

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