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Master Bond adhesives

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Copper Alloy, UNS C67340, H02 Temper, Flat Products
Categories: Metal; Nonferrous Metal; Copper Alloy

Material Notes: Temper: 1/2 Hard

Fabrication Properties: Excellent Suitability – Capacity for Being Hot Formed; Good Suitability – Capacity for Being Cold Worked; Fair Suitability – Soldering, Brazing, Oxyacetylene Welding, Gas Shielded Arc Welding, Coated Metal Arc Welding, Spot Weld, Seam Weld, Butt Weld

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Physical PropertiesOriginal ValueComments
Density 0.295 lb/in³
 
Mechanical PropertiesOriginal ValueComments
Tensile Strength 80.0 ksi
Tensile Strength, Yield 65.0 ksi0.2% Offset
Elongation at Break 20 %
Tensile Modulus 17000 ksi
Machinability 70 %
 
Electrical PropertiesOriginal ValueComments
Electrical Resistivity 0.00000910 ohm-cm19% IACS
 
Thermal PropertiesOriginal ValueComments
CTE, linear 10.9 µin/in-°F
@Temperature 20.0 - 300 °C
Thermal Conductivity 520 BTU-in/hr-ft²-°F
Melting Point 1544 - 1625 °F
Solidus 1544 °F
Liquidus 1625 °F
 
Component Elements PropertiesOriginal ValueComments
Aluminum, Al 0.50 - 1.0 %
Copper, Cu 60 - 63.5 %
Iron, Fe 0.20 - 0.70 %
Lead, Pb <= 0.10 %
Manganese, Mn 1.5 - 2.0 %
Nickel, Ni 0.20 - 0.60 %
Silicon, Si 0.50 - 1.0 %
Zinc, Zn 31.8 - 37.1 %As Balance

References for this datasheet.

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MC67340x1 / 292336

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