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Master Bond adhesives

Materion Beryllium Copper Alloy 25 Plate & Rolled Bar; HT (TH04) Temper; over 9.5 to 25 mm Thickness (UNS C17200)
Categories: Metal; Nonferrous Metal; Beryllium Alloy; Copper Alloy

Material Notes: Treatment required for max strength: 2 hrs @ 330°C or Mill Hardened

Tabulated properties apply to products after age hardening. Information supplied by Brush Wellman.

Brush Engineered Materials Inc. changed its name to Materion Corporation in March 2011.

Key Words: ASTM B-194, AMS 4534, RWMA Class 4
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Physical PropertiesMetricEnglishComments
Density 8.36 g/cc0.302 lb/in³
 
Mechanical PropertiesMetricEnglishComments
Hardness, Rockwell C 38 - 4438 - 44
Tensile Strength, Ultimate 1240 - 1520 MPa180000 - 220000 psi
Tensile Strength, Yield 1060 - 1380 MPa154000 - 200000 psi
Elongation at Break 1.0 - 5.0 %1.0 - 5.0 %
Modulus of Elasticity 131 GPa19000 ksi
 
Electrical PropertiesMetricEnglishComments
Electrical Resistivity 0.00000610 - 0.00000780 ohm-cm0.00000610 - 0.00000780 ohm-cm22-28% IACS Conductivity
 
Thermal PropertiesMetricEnglishComments
CTE, linear 17.0 µm/m-°C
@Temperature 20.0 - 200 °C
9.44 µin/in-°F
@Temperature 68.0 - 392 °F
Thermal Conductivity 105 W/m-K729 BTU-in/hr-ft²-°F
Melting Point 870 - 980 °C1600 - 1800 °F
Solidus 870 °C1600 °F
Liquidus 980 °C1800 °F
 
Component Elements PropertiesMetricEnglishComments
Beryllium, Be 1.8 - 2.0 %1.8 - 2.0 %
Co + Ni >= 0.20 %>= 0.20 %
Co + Ni + Fe <= 0.60 %<= 0.60 %
Copper, Cu 98 %98 %as balance

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NBB554 / 15215

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