Hexcel® HexBond™ ST1480.015 UNS 75g/m2 Epoxy Film Adhesive

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Hexcel® HexBond™ ST1480.015 UNS 75g/m2 Epoxy Film Adhesive
Categories:	Polymer; Thermoset; Epoxy; Epoxy Adhesive
Material Notes:	Description: HexBond™ ST1480 is a modified epoxy film adhesive. This 180°C/356°F cure film adhesive is specially designed for bonding metal-to-metal and composite-to-composite structures. Its formulation, based on epoxy resin, provides high peel strength and toughness with high sheer strength. Features: Excellent metal-to-metal peel strength and composite-to-composite bonding 180°C/356°F cure Service temperature from -55°C to 150°C (-67°F to 302°F) Excellent moisture resistance in high humidity environments Available in a wide range of film thicknesses Applications: Metal-to-metal bonding Sandwich construction Composite-to-composite bonding Information provided by Hexcel Corporation.
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Mechanical Properties	Original Value	Comments

Adhesive Bond Strength	7.10 MPa @Temperature 150 °C	Single Lap Shear Strength Metal/Metal, 2000 hours 70°C / 158°F 85% RH; EN 2243-1
	10.7 MPa @Temperature 180 °C	Single Lap Shear Strength Metal/Metal; EN 2243-1
	13.7 MPa @Temperature 120 °C	Single Lap Shear Strength Metal/Metal, 2000 hours 70°C / 158°F 85% RH; EN 2243-1
	16.1 MPa @Temperature 150 °C	Single Lap Shear Strength Metal/Metal; EN 2243-1
	18.7 MPa @Temperature 120 °C	Single Lap Shear Strength Metal/Metal; EN 2243-1
	22.5 MPa @Temperature 22.8 °C	Single Lap Shear Strength Metal/Metal, 2000 hours 70°C / 158°F 85% RH; EN 2243-1
	25.4 MPa @Temperature 22.8 °C	Single Lap Shear Strength Metal/Metal; EN 2243-1
Peel Strength	3.00 kN/m	Climbing Drum

Thermal Properties	Original Value	Comments
Glass Transition Temp, Tg	111 °C	4h at 150°C, 2000 hours 70°C / 158°F
	119 °C	90 min at 180°C, 2000 hours 70°C / 158°F 85% RH
	180 °C	4h at 150°C
	193 °C	90 min at 180°C

Processing Properties	Original Value	Comments
Cure Time	90.0 min @Temperature 180 °C

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PHEXCB9278 / 322434

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