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Ensinger SPI

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SABIC LNP™ THERMOCOMP™ Compound GX94043L Polysulfone (PSU)
Categories: Polymer; Thermoplastic; Polysulfone (PSU)
Material Notes: LNP THERMOCOMP GX94043L compound is based on Polysulfone (PSU) resin containing mineral. Added features of this grade include: Low Extractables.

Features: Low Extractable,Food Contact Acceptable

Information provided by SABIC
Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Density 1.45 g/ccISO 1183
Water Absorption 0.28 %
@Time 86400 sec		ISO 62-1
Moisture Absorption 0.0500 %Injection Molding
Linear Mold Shrinkage, Flow 0.0025 cm/cm24hrs; ISO 294
Linear Mold Shrinkage, Transverse 0.0035 cm/cm24hrs; ISO 294
 
Mechanical PropertiesOriginal ValueComments
Tensile Strength, Yield 72.0 MPa5 mm/min; ISO 527
Elongation at Break 4.3 %5 mm/min; ISO 527
Tensile Modulus 3500 MPa1 mm/min; ISO 527
Flexural Strength 119 MPayield, 2 mm/min; ISO 178
Flexural Modulus 3800 MPa2 mm/min; ISO 178
Izod Impact, Notched (ISO) 4.00 kJ/m²80*10*4; ISO 180/1A
Izod Impact, Unnotched (ISO) 50.0 kJ/m²80*10*4; ISO 180/1U
 
Thermal PropertiesOriginal ValueComments
CTE, linear, Parallel to Flow 47.0 µm/m-°C
@Temperature 23.0 - 60.0 °C		ISO 11359-2
CTE, linear, Transverse to Flow 50.0 µm/m-°C
@Temperature 23.0 - 60.0 °C		ISO 11359-2
Deflection Temperature at 1.8 MPa (264 psi) 176 °CFlatw 80*10*4 sp=64mm; ISO 75/Af
 
Processing PropertiesOriginal ValueComments
Zone 2 340 - 350 °C
Zone 3 350 - 360 °C
Melt Temperature 360 - 370 °CInjection Molding
Mold Temperature 150 °C
Drying Temperature 120 - 150 °CInjection Molding
Dry Time 4.00 hourInjection Molding
Back Pressure 0.200 - 0.300 MPa
Screw Speed 30 - 60 rpm

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PSABH81608 / 289555

Ensinger SPI




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