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Master Bond adhesives

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SABIC LNP™ THERMOCOMP™ Compound OFC08 Polyphenylene Sulfide, Linear (PPS, Linear)
Categories: Polymer; Thermoplastic; Polyphenylene Sulfide (PPS)

Material Notes: LNP THERMOCOMP OFC08 compound is based on Polyphenylene sulfide (PPS) resin containing 40% glass fiber. Added features of this grade include: High Modulus and Strength, Good Impact Strength and Ductility, Excellent Heat and Chemical Resistance, Good Electrical properties and Inherently Flame-Retardant. It is also an Easy Flow grade with Good Flash Control. Applications of this grade include electric and electronic components, and various parts requiring high strength and high heat resistant.

Features: High Stiffness,Structural

Information provided by SABIC

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Physical PropertiesOriginal ValueComments
Density 1.66 g/ccASTM D792
Water Absorption 0.010 %
@Time 86400 sec
ISO 62-1
Linear Mold Shrinkage, Flow 0.0030 - 0.0060 cm/cmSABIC method
Linear Mold Shrinkage, Transverse 0.0030 - 0.0060 cm/cmSABIC method
 
Mechanical PropertiesOriginal ValueComments
Tensile Strength at Break 190 MPa5 mm/min; ISO 527
Elongation at Break 2.6 %5 mm/min; ISO 527
Tensile Modulus 16000 MPa1 mm/min; ISO 527
Flexural Strength 290 MPa2 mm/min; ISO 178
Flexural Modulus 15000 MPa2 mm/min; ISO 178
Izod Impact, Notched (ISO) 10.0 kJ/m²80*10*4; ISO 180/1A
 10.0 kJ/m²
@Temperature -40.0 °C
80*10*4; ISO 180/1A
Izod Impact, Unnotched (ISO) 50.0 kJ/m²80*10*4; ISO 180/1U
 
Electrical PropertiesOriginal ValueComments
Dielectric Constant 4.0
@Frequency 1.90e+9 Hz
SABIC method
Dissipation Factor 0.0042
@Frequency 1.90e+9 Hz
SABIC method
 
Thermal PropertiesOriginal ValueComments
CTE, linear, Parallel to Flow 20.0 µm/m-°C
@Temperature -40.0 - 95.0 °C
ASTM E831
CTE, linear, Transverse to Flow 40.0 µm/m-°C
@Temperature -40.0 - 95.0 °C
ASTM E831
Deflection Temperature at 1.8 MPa (264 psi) 270 °CFlatw 80*10*4 sp=64mm; ISO 75/Af
 
Processing PropertiesOriginal ValueComments
Nozzle Temperature 310 - 320 °C
Zone 2 310 - 320 °C
Zone 3 320 - 330 °C
Melt Temperature 310 - 330 °CInjection Molding
Mold Temperature 140 - 170 °C
Injection Velocity 100 - 250 mm/sec
Drying Temperature 130 - 140 °CInjection Molding
Dry Time 3.00 - 4.00 hourInjection Molding
Back Pressure 0.300 - 0.500 MPa
Screw Speed 50 - 100 rpm

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PSABH81763 / 289710

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