BASF 3D Ultrafuse® BVOH Fused Fillament

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BASF 3D Ultrafuse® BVOH Fused Fillament
Categories:	Polymer; 3D Printing/Additive Manufacturing Polymer
Material Notes:	Components: Butenediol vinyl alcohol copolymer based filament for Fused Filament Fabrication. Product Description: Printing complex designs may only be possible with temporary support structures. Ultrafuse BVOH water-soluble support filament has been designed to easily dissolve in water. The solubility is increasing with higher water temperature. It offers great compatibility to a variety of materials: PLA, PRO1, ABS, ABS Fusion+, PA and PAHT CF15. Store this monofilament in a sealed bag or container to prevent moisture uptake. Information provided by BASF
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Physical Properties	Original Value	Comments

Density	1.138 g/cc	Printed Part; ISO 1183-1
Melt Flow	12.9732 g/10 min @Load 2.16 kg, Temperature 210 °C	ISO 1133
Storage Temperature	15.0 - 25.0 °C

Mechanical Properties	Original Value	Comments
Tensile Strength	8.70 MPa	ZX: Upright; ISO 527
	33.7 MPa	XY: Flat; ISO 527
Elongation at Break	0.60 %	ZX: Upright; ISO 527
	14.8 %	XY: Flat; ISO 527
Modulus of Elasticity	1.426 GPa	Young's, ZX: Upright; ISO 527
	2.339 GPa	Young's, XY: Flat; ISO 527
Flexural Strength	11.4 MPa	ZX: Upright; ISO 178
	50.3 MPa	XZ: On its edge; ISO 178
	53.8 MPa	XY: Flat; ISO 178
Flexural Modulus	1081 MPa	ZX: Upright; ISO 178
	1807 MPa	XZ: On its edge; ISO 178
	2236 MPa	XY: Flat; ISO 178
Flexural Strain at Break	1.0 %	ZX: Upright; ISO 178
	4.4 %	XZ: On its edge; ISO 178
	4.8 %	XY: Flat; ISO 178

Thermal Properties	Original Value	Comments
Melting Point	175 °C	ISO 11357-3
Deflection Temperature at 0.46 MPa (66 psi)	122 °C	ISO 75-2
Deflection Temperature at 1.8 MPa (264 psi)	69.0 °C	ISO 75-2

Processing Properties	Original Value	Comments
Processing Temperature	60.0 - 100 °C	Bed, Bed Material: PC adhesive
Nozzle Temperature	190 - 210 °C
Drying Temperature	60.0 °C	in a hot air dryer or vacuum oven
Dry Time	4.00 - 16.0 hour
Shelf Life	12.0 Month

Descriptive Properties
Nozzle Diameter	=0.4 mm
Print speed	30-60 mm/s

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PBASF3D021 / 312262

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