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Master Bond adhesives

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Parker Chomerics THERMATTACH® T422 Thermally Conductive BGA Assembly Tape  (discontinued **)
Categories: Polymer; Adhesive

Material Notes: THERMATTACH have been designed to provide a high performance bond in the assembly of EBGA and TBGA semiconductor packages. Their thermally conductive filler ensures superior package performance when used to bond the flex or laminate substrate to stiffeners and heat spreaders.

Information provided by Chomerics

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Physical PropertiesOriginal ValueComments
Specific Gravity 1.60 g/ccASTM D792
Thickness 3.00 milASTM D374
 
Mechanical PropertiesOriginal ValueComments
Adhesive Bond Strength 150 psiDie Shear Adhesion (CTP No.54)
Peel Strength >= 0.600 kN/mASTM D1000
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity >= 1.00e+14 ohm-cmASTM D257
 
Thermal PropertiesOriginal ValueComments
Thermal Conductivity 0.430 W/m-KASTM D5470
 
Descriptive Properties
BinderAcrylic
FillerAluminum Oxide
Tack Adhesion, gm (Polyken PSTC)500

**
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