Oxygen-free silver-bearing Copper, UNS C10500, H04 Temper wire

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Oxygen-free silver-bearing Copper, UNS C10500, H04 Temper wire
Categories:	Metal; Nonferrous Metal; Copper Alloy
Material Notes:	Good to excellent corrosion resistance. Excellent hot and cold workability; good forgeability. Fabricated by coining, coppersmithing, drawing and upsetting, hot forging and pressing, spinning, swaging, stamping. Applications: auto gaskets, radiators, busbars, conductivity wire, contacts, radio parts, winding, switches, terminals, commutator segments, chemical process equipment, printing rolls, clad metals, printed circuit foil. Test specimens: wire - 2mm diameter. Similar alloys distinguished only by silver content: 8 oz/ton Ag (UNS C10400), 10 oz/ton Ag (UNS C10500), 25 oz/ton Ag (UNS C10700).
Key Words:	AMSIL Copper; Oxygen-free Silver-Copper; QQ-W-343, MIL-W-3318
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Physical Properties	Original Value	Comments

Density	8.94 g/cc	UNS C10700

Mechanical Properties	Original Value	Comments
Tensile Strength, Ultimate	380 MPa
Elongation at Break	1.5 %	in 25 mm
Modulus of Elasticity	115 GPa
Poissons Ratio	0.307
Machinability	20 %	UNS C36000 (free-cutting brass) = 100%
Forgeability	65 %
Shear Modulus	44.0 GPa
Shear Strength	200 MPa

Electrical Properties	Original Value	Comments
Electrical Resistivity	0.00000172 ohm-cm @Temperature 20.0 °C

Thermal Properties	Original Value	Comments
CTE, linear	17.0 µm/m-°C @Temperature 20.0 - 100 °C
	17.3 µm/m-°C @Temperature 20.0 - 200 °C
	17.7 µm/m-°C @Temperature 20.0 - 300 °C
Specific Heat Capacity	0.385 J/g-°C
Thermal Conductivity	388 W/m-K @Temperature 20.0 °C
Melting Point	<= 1083 °C
Solidus	1083 °C
Liquidus	1083 °C
Annealing Point	>= 900 °F

Processing Properties	Original Value	Comments
Annealing Temperature	475 - 750 °C
Hot-Working Temperature	750 - 875 °C

Component Elements Properties	Original Value	Comments
Copper, Cu	>= 99.95 %	Includes Ag
Silver, Ag	>= 0.034 %	Min 10 troy oz./ton

References for this datasheet.

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MC10500c2 / 10444

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