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Master Bond adhesives

Honeywell HLT3500 Thermally Conductive Gel
Categories: Other Engineering Material

Material Notes: Benefits And Features:
  • Low contact resistance
  • Easy to dispense and rework
  • High compressibility for low stress applications
  • Long-term reliability
  • Less oil separation
  • No pump out and cracking
Overview: Honeywell HLT2000 and HLT3500 are two-part, dispensable thermally conductive gel, which offer long-term reliability and superior softness. The enhanced bonding force between the polymer base and the filler largely improves the thermally conductive gel oil separation issue in storage. Prior to curing, the material maintains good thixotropic characteristics and low viscosity to be easily dispensed. The product can be cured in short time after two-component mixing at room temperature. The high compressibility minimizes thermal resistance at interfaces, while maintaining excellent performance during reliability testing.

Typical Applications:

  • Consumer electronics
  • Telecommunications equipment
  • Automotive electronics
  • Memory & power modules

Information provided by Honeywell

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Specific Gravity 3.20 g/cc3.20 g/ccASTM D792
Brookfield Viscosity 300000 - 450000 cP300000 - 450000 cP#7 spindle, 10rpm; ASTM D2196
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore OO 5050ASTM D2240
 
Thermal PropertiesMetricEnglishComments
Thermal Conductivity 3.50 W/m-K24.3 BTU-in/hr-ft²-°FASTM D5470
 
Processing PropertiesMetricEnglishComments
Cure Time 30.0 min
@Temperature 100 °C
0.500 hour
@Temperature 212 °F
Shelf Life 6.00 Month6.00 Month
 
Descriptive Properties
ColorBluePart B
 WhitePart A

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PHONWL6001 / 255331

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