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Trinseo EMERGE™ PC 8701-15 Polycarbonate Resin
Categories: Polymer; Thermoplastic; Polycarbonate (PC); Polycarbonate, 10% Glass Filled

Material Notes: EMERGE™ PC 8701 advanced resin is an ignition-resistant, 10% glass reinforced polycarbonate resin. This resin contains no bromine, chlorine or phosphate additives. It is a medium flow PC resin with a mold release system, intended for applications requiring high stiffness. It has a UL94 flammability rating of V-0 at 1.5 mm.

Main Characteristics:

  • Glass reinforced
  • Ignition resistant
Applications:
  • Powered Device Housings
  • Information technology equipment
  • Electrical parts
  • Other structural/internal parts

Information provided by Trinseo.

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Physical PropertiesOriginal ValueComments
Density 1.28 g/ccISO 1183/B
Linear Mold Shrinkage 0.0040 - 0.0060 in/inISO 294-4
Melt Flow 15 g/10 min
@Load 1.20 kg,
Temperature 300 °C
ISO 1133
 
Mechanical PropertiesOriginal ValueComments
Tensile Strength at Break 50.0 MPa
@Thickness 4.00 mm
Injection Molded; ISO 527-2/50
Tensile Strength, Yield 65.0 MPa
@Thickness 4.00 mm
Injection Molded; ISO 527-2/50
Elongation at Break 9.0 %
@Thickness 4.00 mm
Injection Molded; ISO 527-2/50
Elongation at Yield 4.0 %
@Thickness 4.00 mm
Injection Molded; ISO 527-2/50
Tensile Modulus 3950 MPa
@Thickness 4.00 mm
Injection Molded; ISO 527-2/1
 4000 MPa
@Thickness 4.00 mm
Injection Molded; ISO 527-2/50
Flexural Strength 105 MPa
@Thickness 4.00 mm
Injection Molded, 2.0 mm/min; ISO 178
Flexural Modulus 3800 MPaInjection Molded, 2.0 mm/min; ISO 178
Izod Impact, Notched (ISO) 9.00 kJ/m²Injection Molded; ISO 180/A
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity >= 1.00e+16 ohm-cmIEC 60093
Surface Resistance 1.00e+14 ohmIEC 60093
Dielectric Constant 3.0
@Frequency 50 Hz
IEC 60250
 3.1
@Frequency 1e+6 Hz
IEC 60250
Dielectric Strength >= 70.0 kV/mmIEC 60243-1
Dissipation Factor 0.016
@Frequency 1e+6 Hz
IEC 60250
Comparative Tracking Index 200 V
@Thickness 3.00 mm
Solution A; IEC 60112
 
Thermal PropertiesOriginal ValueComments
CTE, linear, Parallel to Flow 15.0 µm/m-°C
@Temperature -40.0 - 80.0 °C
ASTM D696
Hot Ball Pressure Test >= 125 °CIEC 60335-1
Deflection Temperature at 0.46 MPa (66 psi) 141 °CAnnealed; ISO 75-2/B
Deflection Temperature at 1.8 MPa (264 psi) 133 °CUnannealed; ISO 75-2/A
 139 °CAnnealed; ISO 75-2/A
Vicat Softening Point 145 °CISO 306/B50
 155 °CISO 306/A120
Flammability, UL94 V-0
@Thickness 1.50 mm
Oxygen Index 29 %ISO 4589-2
Glow Wire Ignition Temperature 960 °C
@Thickness 1.00 mm
IEC 60695-2-13
 960 °C
@Thickness 2.00 mm
IEC 60695-2-13
 960 °C
@Thickness 3.00 mm
IEC 60695-2-13
 
Processing PropertiesOriginal ValueComments
Melt Temperature 290 - 315 °C
Mold Temperature 80.0 - 115 °C
Drying Temperature 120 °C
Dry Time 3.00 - 4.00 hour

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PTRINS9047 / 197546

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