Epoxy Technology EPO-TEK® ED1021 Epoxy

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Epoxy Technology EPO-TEK® ED1021 Epoxy
Categories:	Polymer; Thermoset; Epoxy
Material Notes:	Preliminary Product Information Sheet Material Description: A single component, silver-filled epoxy designed for low power semiconductor LED die attach applications. Unique features include its ability to achieve high thermal conductivity values at low cure temperatures and a very shiny silver appearance which enhances overall LED brightness. Other benefits include long pot-life, low viscosity and high thixotropy making it ideal for wafer level stamping as well as syringe dispensing. Information Provided by Epoxy Technology
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Physical Properties	Metric	English	Comments

Specific Gravity	2.80 g/cc	2.80 g/cc
Particle Size	<= 20 µm	<= 20 µm
Viscosity	1819 cP @Temperature 23.0 °C	1819 cP @Temperature 73.4 °F	100 rpm
	8782 cP @Temperature 23.0 °C	8782 cP @Temperature 73.4 °F	10 rpm
	37282 cP @Temperature 23.0 °C	37282 cP @Temperature 73.4 °F	1 rpm

Chemical Properties	Metric	English	Comments
Ionic Impurities - Na (Sodium)	3.0 ppm	3.0 ppm
Ionic Impurities - K (Potassium)	1.0 ppm	1.0 ppm
Ionic Impurities - Cl (Chloride)	<= 10 ppm	<= 10 ppm

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	82	82
Tensile Modulus	0.1782 GPa	25.85 ksi	Storage

Electrical Properties	Metric	English	Comments
Volume Resistivity	<= 0.00020 ohm-cm	<= 0.00020 ohm-cm

Thermal Properties	Metric	English	Comments
CTE, linear	5.20 µm/m-°C	2.89 µin/in-°F	Below Tg
	184 µm/m-°C	102 µin/in-°F	Above Tg
Thermal Conductivity	3.30 W/m-K	22.9 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air	200 °C	392 °F	Continuous
	300 °C	572 °F	Intermittent
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F	Continuous
	-55.0 °C	-67.0 °F	Intermittent
Glass Transition Temp, Tg	>= 48.0 °C	>= 118 °F
Decomposition Temperature	403 °C	757 °F	Degradation Temperature

Processing Properties	Metric	English	Comments
Cure Time	30.0 min @Temperature 150 °C	0.500 hour @Temperature 302 °F
Pot Life	129600 min	129600 min
Shelf Life	12.0 Month @Temperature -40.0 °C	12.0 Month @Temperature -40.0 °F

Descriptive Properties
Color	Silver
Consistency	Smooth thixotropic paste
Die Shear	12 kg		After 1000hrs 85°C/85% RH
	12.4 kg		Initial
Ionic Impurities NH₄	9 ppm
Number of Components	Single
Thixotropic Index	4.2
Weight Loss	0.35%		200°C
	0.41%		250°C
	0.56%		300°C

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PPOXYT017 / 141055

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