Solvay FM® 355 Epoxy Film Adhesive

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Solvay FM® 355 Epoxy Film Adhesive
Categories:	Polymer; Adhesive; Thermoset; Epoxy; Epoxy Adhesive
Material Notes:	FM 355 is a modified epoxy adhesive formulated to maximize toughness in applications requiring hot/wet performance to 350°F (177°C) cure. It contains no asbestos or aluminum fillers which is desirable for radar transparent applications. FM 355 adhesive film is supported with a lightweight nylon carrier and will cure at 350°F (177°C) in one hour. For composite bonding applications, FM 355 adhesive provides excellent toughness and shear strength properties. It was developed for co-cure as well as secondary bonding applications. In addition, FM 355 adhesive can be co-cured with epoxy or bismaleimide (BMI) composite systems requiring post-cures of up to 475°F (246°C). Features & Benefits: Excellent strength in both metallic and composite structures 350°F (177°C) service temperature with good strength retention up to 420°F (216°C) Controlled flow Does not contain asbestos or aluminum fillers Radar transparent Information provided by Cytec, subsequently acquired by Solvay.
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Physical Properties	Original Value	Comments

Volatiles	<= 1.0 %
Storage Temperature	<= -18.0 °C

Mechanical Properties	Original Value	Comments
Tensile Strength	235 - 290 psi	Flatwise, tested at RT after 10,000 hrs at 177°C (range for 3 batches tested)
	535 - 550 psi	Flatwise, tested at RT after 5000 hrs at 177°C (range for 3 batches tested)
	570 - 655 psi	Flatwise, tested at RT after 1000 hrs at 177°C (range for 3 batches tested)
	860 - 910 psi	Flatwise (range for 3 batches tested)
	725 psi @Temperature 177 °C	Flatwise, tested with non-metallic substrates
	800 psi @Temperature 177 °C	Flatwise, tested with Metallic substrates
	1000 psi @Temperature 24.0 °C	Flatwise, tested with Metallic substrates
	1000 psi @Temperature 24.0 °C	Flatwise, tested with non-metallic substrates
Shear Strength	1600 psi @Temperature 232 °C	1/2" Lap, versus cleaned/etched metallic substrate, cured at 350°F (177°C)
	2200 psi @Temperature 215 °C	1/2" Lap, versus cleaned/etched metallic substrate, standard cure
	3000 psi @Temperature 177 °C	1/2" Lap, versus cleaned/etched metallic substrate, standard cure
	3100 psi @Temperature 24.0 °C	1/2" Lap, versus cleaned/etched metallic substrate, standard cure
	3300 psi @Temperature -55.0 °C	1/2" Lap, versus cleaned/etched metallic substrate, standard cure
	3600 psi @Temperature 121 °C	1/2" Lap, versus cleaned/etched metallic substrate, standard cure

Thermal Properties	Original Value	Comments
Maximum Service Temperature, Air	177 °C	service temperature
	216 °C	good strength retention

Processing Properties	Original Value	Comments
Processing Temperature	350 °F @Time 3600 sec	Standard Cure
Shelf Life	6.00 Month

Descriptive Properties
Color	Blue
Sandwich Peel	40 Nm/m	tested with metallic substrates
	52 Nm/m	tested with non-metallic substrates

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PCYTED034 / 180336

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