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Master Bond adhesives

Skybond® 875 Aromatic Polyimide Two Stage Resin
Categories: Polymer; Thermoset; Polyimide, TS

Material Notes: Two-stage cure polyimide resin that when used in prepreg applications allows the manufacture of very low void level composites by autoclave processing (<0.5% voids), combined with excellent thermal stability.

Information provided by Industrial Summit Technology Corporation.

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Physical PropertiesMetricEnglishComments
Solids Content 37 - 39 %37 - 39 %
Viscosity 1500 - 3000 cP
@Temperature 250 °C
1500 - 3000 cP
@Temperature 482 °F
Melt
 
Thermal PropertiesMetricEnglishComments
Glass Transition Temp, Tg 325 - 335 °C617 - 635 °FResin

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

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PISTEC991 / 183053

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