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Ensinger PEI

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Parker Chomerics CHO-FORM® 5515 Robotically Dispensed Gasketing
Categories: Polymer; Thermoset; Silicone

Material Notes: Description: CHO-FORM® 5515 One-component, thermal cure silicone system, with Ni/Graphite filler. Minimum cure temperature is 100°C (212°F). A low-cost solution for EMI shielding, it is specially formulated to reduce galvanic activity between the housing and EMI gasket, and for use on outdoor applications requiring long-term corrosion resistance.

Information provided by Chomerics

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Physical PropertiesOriginal ValueComments
Specific Gravity 1.80 g/ccASTM D792
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore A 50 - 75ASTM D2240
Tensile Strength >= 450 psiASTM D412
Elongation at Break >= 100 %ASTM D412
Compression Set <= 25 %
@Temperature 85.0 °C,
Time 79200 sec
ASTM D395 Method B
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity <= 0.20 ohm-cmInitial; MIL-G-83528 Para. 4.6.11
 <= 0.30 ohm-cmAged; MIL-G-83528 Para. 4.6.15
Shielding Effectiveness 75 - 85 dBmodified specimen 0.85 mm x 1.0 mm bead with plastic bolts; MIL-G-83528 Para. 4.6.12
 
Thermal PropertiesOriginal ValueComments
Maximum Service Temperature, Air 100 °C
 
Processing PropertiesOriginal ValueComments
Cure Time 0.500 hour
@Temperature 140 °C
 
Descriptive Properties
Adhesion>8 N/cm2WI 038
Cure SystemHeat
FillerNi/Graphite
Mix Ratio1-part

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PCHOME212 / 130922

Proto3000 – 3D Engineering Solutions

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