Park Aerospace Nelco® N4000-12 SI® High Speed/Low Loss, CAF Resistant Laminate and Prepreg

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Park Aerospace Nelco® N4000-12 SI® High Speed/Low Loss, CAF Resistant Laminate and Prepreg
Categories:	Polymer; Thermoset; Epoxy
Material Notes:	The Nelco® N4000-12 series is an enhanced epoxy resin system designed for use in high speed, low loss applications requiring thermal stability, excellent signal speed and CAF resistance. Key Features and Benefits: Lead-Free Assembly Compatible Tg >190ºC, robust thermal stability High Speed and Low Loss Properties CAF Resistant SI (Signal Integrity) option High-Tg FR-4 processing Applications/Qualifications: Lead-Free Assemblies Fine-Line Multilayers Backplanes Surface-Mount Multilayers BGA Multilayers SIPs MCM-Ls Direct Chip Attach Network Storage Wireless Communications Infrastructure High Speed Computing Information provided by Park Electrochemical Corp.
Key Words:	EP
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Physical Properties	Original Value	Comments

Density	1.78 g/cc	50% Resin Content; Internal Method
Water Absorption	0.090 %	IPC-TM-650.2.6.2.1

Mechanical Properties	Original Value	Comments
Peel Strength	8.70 pli	at elevated temperature; IPC-TM-650.2.4.8.2a
	9.20 pli	after solder float; IPC-TM-650.2.4.8
	9.30 pli	after exposure to process solutions; IPC-TM-650.2.4.8

Electrical Properties	Original Value	Comments
Volume Resistivity	1.00e+14 ohm-cm	C - 96/35/90; IPC-TM-650.2.5.17.1
	1.00e+14 ohm-cm	E - 24/125; IPC-TM-650.2.5.17.1
Surface Resistance	1.00e+12 ohm	E - 24/125; IPC-TM-650.2.5.17.1
	1.00e+14 ohm	C - 96/35/90; IPC-TM-650.2.5.17.1
Dielectric Constant	3.3 @Frequency 1e+10 Hz	Stripline; IPC-TM-650.2.5.5.5
	3.3 @Frequency 1e+10 Hz	Split Post Cavity
	3.4 @Frequency 1e+9 Hz	RF Impedance; IPC-TM-650.2.5.5.9
Dielectric Breakdown	>= 50000 V	IPC-TM-650.2.5.6
Dissipation Factor	0.0060 @Frequency 2.50e+9 Hz	Split Post Cavity
	0.0070 @Frequency 1e+10 Hz	Split Post Cavity
Arc Resistance	65 sec	IPC-TM-650.2.5.1

Thermal Properties	Original Value	Comments
CTE, linear	6.67 - 8.62 µin/in-°F @Temperature -40.0 - 125 °C	X/Y; IPC-TM-650.2.4.41
	33.36 µin/in-°F @Temperature 50.0 - 190 °C	Z-Axis Alpha 1; IPC-TM-650.2.4.41
	144.56 µin/in-°F @Temperature 190 - 260 °C	Z-Axis Alpha 2; IPC-TM-650.2.4.41
Specific Heat Capacity	0.270 BTU/lb-°F	ASTM E1461
Thermal Conductivity	2.01 BTU-in/hr-ft²-°F	ASTM E1461
Glass Transition Temp, Tg	180 °C	TMA; IPC-TM-650.2.4.24c
	190 °C	DSC; IPC-TM-650.2.4.25c
	210 °C	DMA (Tan d Peak); IPC-TM-650.2.4.24.3
Decomposition Temperature	370 °C	5% weight loss; TGA; IPC-TM-650.2.4.24.6
Flammability, UL94	V-0

Descriptive Properties
Methylene Chloride Resistance (% Weight Change)	1	IPC-TM-650.2.3.4.3
Pressure Cooker	Pass	60 min then solder dip @288ºC until failure (max 10 min.); IPC-TM-650.2.6.16 (modified)
T260 (minutes)	>60	IPC-TM-650.2.4.24.1
Z Axis Expansion (%)	3.6	50ºC to 260ºC; IPC-TM-650.2.4.41

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PPARK105 / 89377

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