Solvay FM® 94M Adhesive Film

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Solvay FM® 94M Adhesive Film
Categories:	Polymer; Film; Thermoset; Epoxy
Material Notes:	Description: FM® 94 adhesive is a 220°F (104°C) service temperature, modified epoxy film adhesive designed for bonding metallic and composite structures. FM 94 adhesive offers a unique combination of high temperature performance, toughness and moisture resistance as demonstrated by its ability to bond to wet Nomex® honeycomb and retention of shear properties after pre- and post-bond humidity exposure. FM 94 adhesive is designed for applications demanding the best of both 220°F (104°C) service temperature and -67°F (-55°C) peel strength. For composite and metal bonding applications, FM 94 adhesive is formulated to exhibit superior elongation, toughness and shear strength properties. The controlled flow characteristics allow for its use in co-cured applications as well as bonding pre-cured structures. Also, FM 94 adhesive provides excellent electrical insulation between metal and graphite composites, reducing the potential for galvanic corrosion. FM 94 film adhesive is manufactured as a supported adhesive with both knit and mat carriers, or as an unsupported film. When supported with a knit carrier, optimal mechanical properties can be obtained. The random mat provides superior handling characteristics. With the mat carrier, FM 94 adhesive can be supplied in a one-side tacky (OST) version which helps reduce air entrapment when bonding large metal or composite parts. Features & Benefits: Demonstrates superior strength in bonding both metallic and composite structures Provides structural performance from -67°F to 220°F (-55°C to 104°C) Offers exceptional elongation and toughness Higher service temperature version of FM® 73 film adhesive Applications: Bonding of metallic and composite structures Note 1: Aluminum Substrate with BR® 6747-1 Adhesive Primer Note 2: FM 94K 0.06 psf (293 gsm) Film Adhesive after Humidity, Salt Spray and Solvent Exposure, Aluminum Substrate with BR 6747-1 Adhesive Primer Note 3: FM 94K 0.06 psf (293 gsm) Film Adhesive, Effect of Cure Cycle, Aluminum Substrates with BR 6747-1 Adhesive Prime Note 4: FM 94K 0.06 psf (293 gsm) Film Adhesive with BR 6747-1 Adhesive Primer Note 5: Effect of Humidity, Wet Nomex Bonding with FM 94M 0.06 psf (293 gsm) Film Adhesive, Immersed in water for 24 hours at 140°F (60°C) then bonded within 2 hours Note 6: Composite Substrates Co-cure Data with FM 94M 0.06 psf (293 gsm) Film Adhesive Note 7: Secondary Bonding of Epoxy/Graphite Substrates with FM 94M 0.06 psf (293 gsm) Film Adhesive Information provided by Cytec, subsequently acquired by Solvay.
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Physical Properties	Original Value	Comments

Volatiles	<= 1.0 %
Storage Temperature	-18.0 °C

Mechanical Properties	Original Value	Comments
Tensile Strength	1115 psi	Flatwise, FM 94 co-cured with BMS 8-79 prepreg (epoxy/glass), BMS 8-124 core (Type 1, Class 1), Note 6
	355 psi @Temperature 104 °C	Flatwise, 0.06 psf, Note 1
	442 psi @Temperature 24.0 °C	Flatwise, CYCOM® 950-1 3K 70P 3 plies Composite surface preparation: nylon peel ply, Note 7
	446 psi @Temperature 82.0 °C	Flatwise, CYCOM® 950-1 3K 70P 3 plies Composite surface preparation: nylon peel ply, Note 7
	540 psi @Temperature 71.0 °C	Flatwise, Note 5
	610 psi @Temperature 24.0 °C	Flatwise, Note 5
	645 psi @Temperature 82.0 °C	Flatwise, 0.06 psf, Note 1
	1250 psi @Temperature 24.0 °C	Flatwise, 0.06 psf, Note 1
	1675 psi @Temperature -55.0 °C	Flatwise, 0.06 psf, Note 1
Shear Strength	2490 psi @Temperature 121 °C	Wide Area Blister Detection, 0.06 psf, Note 1; ASTM D3165
	2570 psi @Temperature 82.0 °C	CYCOM 985 3K 70P, 0.1 in (2.54 mm) thick, Note 7
	2850 psi @Temperature 82.0 °C	FM 94M co-cured with CYCOM® 985 3K 70P (BMS 8-212 prepreg), Note 6
	3000 psi @Temperature 71.0 °C	CYCOM 985 3K 70P, 0.1 in (2.54 mm) thick, Note 7
	3040 psi @Temperature 82.0 °C	FM 94M co-cured with CYCOM® 985 3K 70P (BMS 8-212 prepreg), Exposure: 30 days at 160°F (71°C), 100% RH, Note 6
	3410 psi @Temperature 104 °C	Wide Area Blister Detection, 0.06 psf, Note 1; ASTM D3165
	3450 psi @Temperature 24.0 °C	CYCOM 985 3K 70P, 0.1 in (2.54 mm) thick, Note 7
	3515 psi @Temperature 104 °C	0.06 psf, Note 1; ASTM D1002
	3695 psi @Temperature 82.0 °C	Wide Area Blister Detection, 0.06 psf, Note 1; ASTM D3165
	3710 psi @Temperature 24.0 °C	FM 94M co-cured with CYCOM® 985 3K 70P (BMS 8-212 prepreg), Note 6
	4200 psi @Temperature 24.0 °C	FM 94M co-cured with CYCOM® 985 3K 70P (BMS 8-212 prepreg), Exposure: 30 days at 160°F (71°C), 100% RH, Note 6
	4855 psi @Temperature 82.0 °C	0.06 psf, Note 1; ASTM D1002
	5195 psi @Temperature 24.0 °C	Wide Area Blister Detection, 0.06 psf, Note 1; ASTM D3165
	5215 psi @Temperature -55.0 °C	Wide Area Blister Detection, 0.06 psf, Note 1; ASTM D3165
	6080 psi @Temperature -55.0 °C	0.06 psf, Note 1; ASTM D1002
	6340 psi @Temperature 24.0 °C	0.06 psf, Note 1; ASTM D1002
Peel Strength	52.0 pli @Temperature -55.0 °C	Floating Roller, 0.06 psf, Note 1; ASTM D3167
	60.0 pli @Temperature 104 °C	Floating Roller, 0.06 psf, Note 1; ASTM D3167
	70.0 pli @Temperature 24.0 °C	Floating Roller, 0.06 psf, Note 1; ASTM D3167
	70.0 pli @Temperature 82.0 °C	Floating Roller, 0.06 psf, Note 1; ASTM D3167

Thermal Properties	Original Value	Comments
Maximum Service Temperature, Air	104 °C
Minimum Service Temperature, Air	-55.0 °C

Processing Properties	Original Value	Comments
Shelf Life	12.0 Month

Descriptive Properties
Color	Green
Honeycomb Sandwich Peel	107 Nm/m	93°C, Note 1, ASTM D1781
	75.6 Nm/m	104°C, Note 1, ASTM D1781
	89 Nm/m	24°C, Note 1, ASTM D1781
Metal-to-Metal Climbing Drum Peel	334 Nm/m	104°C, Note 1, ASTM D1781
	347 Nm/m	93°C, Note 1, ASTM D1781
	356 Nm/m	24°C, Note 1, ASTM D1781

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PCYTED105 / 180407

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