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Metal adhesives

Resinlab® EP1112 Black Electronic Grade Epoxy Encapsulant
Categories: Polymer; Thermoset; Epoxy; Epoxy Encapsulant, Unreinforced

Material Notes: Resinlab™ EP 1112 Black is a two part unfilled fast curing electronic grade epoxy encapsulant designed for small to medium sized castings. It cures completely at room temperature to a tough, flexible polymer. Its low viscosity allows for good wicking and penetration into components and circuitry and also gives good air release. It has very good resistance to water, acids and bases and most organic solvents. Thermal shock and cycling properties are also enhanced by its high elongation giving it the ability to absorb difference in CTE's of substrates. It was especially formulated to a 1A:1B volume mix ratio for use in side-by-side dispensing cartridges and meter/mix and dispense equipment. EP 1112 Black will reach full cure at room temperature within 6 to 12 hours. Cure time can be accelerated by the application of heat after product has gelled. Times and temperatures from 1 hour at 65°C to 10 minutes at 100°C are typical for small castings (less than 50 grams).

Information Provided by Resinlab L.L.C., an Ellsworth Adhesives Company.

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Physical PropertiesMetricEnglishComments
Specific Gravity 0.960 g/cc0.960 g/ccPart B
 1.04 g/cc1.04 g/ccMixed
 1.11 g/cc1.11 g/ccPart A
Viscosity 1200 cP1200 cPPart A
 1200 cP1200 cPPart B
 1200 cP1200 cPMixed
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore D 7070
Tensile Strength, Ultimate 8.27 MPa1200 psi
Tensile Strength, Yield 4.14 MPa600 psi
Elongation at Break 50 %50 %
Elongation at Yield 3.0 - 5.0 %3.0 - 5.0 %
Tensile Modulus 0.138 GPa20.0 ksi
Compressive Yield Strength 4.83 MPa700 psi
Compressive Strength 93.1 MPa13500 psi
Compressive Modulus 2.76 GPa400 ksi
Adhesive Bond Strength 8.27 MPa1200 psiLap shear; 2024 T3 Al Abraded / MEK Wipe
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 4.00e+14 ohm-cm4.00e+14 ohm-cm
Dielectric Constant 4.1
@Frequency 100 Hz,
Temperature 25.0 °C
4.1
@Frequency 100 Hz,
Temperature 77.0 °F
Dielectric Strength 16.1 kV/mm410 kV/in
 
Thermal PropertiesMetricEnglishComments
CTE, linear 62.0 µm/m-°C34.4 µin/in-°F
Thermal Conductivity 0.170 W/m-K1.18 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 150 °C302 °F
Minimum Service Temperature, Air -40.0 °C-40.0 °F
Glass Transition Temp, Tg 42.0 °C108 °F
 
Processing PropertiesMetricEnglishComments
Pot Life 10 - 15 min10 - 15 minMass: 50g
 
Descriptive Properties
ColorBlack
Mix Ratio1:1Volume
 100:85Weight

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

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PRESL097 / 101511

Metal adhesives

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