Master Bond Polymer System EP21TDCNFL is a two component, nickel filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. Its most noteworthy properties are its high flexibility and elongation. Its exceptional flexibility makes EP21TDCNFL particularly useful in bonding dissimilar substrates that are being thermally cycled and shocked. Additionally, its high flexibility combined with its inherently low shrinkage enables the cured system to exert very little mechanical stress on sensitive components and substrates. |
Master Bond is a leading manufacturer of adhesives, sealants, coatings and potting compounds. Master Bond’s vast product line consists of over 3,000 epoxy, polyurethane, silicone, cyanoacrylate and latex adhesives that vary in viscosity, cure speed, strength, chemical resistance, electrical properties, etc. Our custom adhesives offer design flexibility and provide excellent bonding performance. Visit www.masterbond.com.Click here to view all available suppliers for this material. Please click here if you are a supplier and would like information on how to add your listing to this material. |