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Master Bond adhesives

CP-Polymer-Technik Wellamid® 6600 GV 30 HWCP 30% Glass Fiber Nylon 66, Heat Stabilized, Dry
Categories: Polymer; Thermoplastic; Nylon (Polyamide PA); Nylon 66 (PA66); Nylon 66, 30% Glass Fiber Filled

Material Notes: Information provided by CP-Polymer-Technik GmbH & Co. KG

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Density 1.36 g/cc0.0491 lb/in³ISO 1183
Moisture Absorption at Equilibrium 1.8 - 2.3 %1.8 - 2.3 %23°C/50%RH; DIN 53495
Linear Mold Shrinkage 0.0020 cm/cm
@Thickness 4.00 mm
0.0020 in/in
@Thickness 0.157 in
Linear Mold Shrinkage, Transverse 0.0070 cm/cm
@Thickness 4.00 mm
0.0070 in/in
@Thickness 0.157 in
 
Mechanical PropertiesMetricEnglishComments
Tensile Strength at Break 180 MPa26100 psi5 mm/min; ISO 527
Elongation at Break 3.5 %3.5 %5 mm/min; ISO 527
Tensile Modulus 9.50 GPa1380 ksiISO 527
Flexural Modulus 8.40 GPa1220 ksiDIN 52457
Charpy Impact Unnotched 9.00 J/cm²
@Temperature 23.0 °C
42.8 ft-lb/in²
@Temperature 73.4 °F
ISO 179
Charpy Impact, Notched 1.20 J/cm²
@Temperature 23.0 °C
5.71 ft-lb/in²
@Temperature 73.4 °F
ISO 179
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 1.00e+15 ohm-cm1.00e+15 ohm-cmIEC 93
Surface Resistance 1.00e+12 ohm1.00e+12 ohmISO 3915
Dielectric Constant 4.0
@Frequency 1e+6 Hz
4.0
@Frequency 1e+6 Hz
IEC 250
Dielectric Strength 40.0 kV/mm1020 kV/inIEC 243-1
Dielectric Loss Index 0.015
@Frequency 1e+6 Hz
0.015
@Frequency 1e+6 Hz
IEC 250
Comparative Tracking Index 550 V550 VStufe; IEC 112
 
Thermal PropertiesMetricEnglishComments
CTE, linear 20.0 µm/m-°C
@Temperature 23.0 - 80.0 °C
11.1 µin/in-°F
@Temperature 73.4 - 176 °F
DIN 53752
Melting Point 255 °C491 °FKofler
Deflection Temperature at 0.46 MPa (66 psi) 250 °C482 °FISO 179
Deflection Temperature at 1.8 MPa (264 psi) 250 °C482 °FISO 179
Vicat Softening Point 230 °C446 °F50 N; ISO 306
Flammability, UL94  HB
@Thickness 1.60 mm
HB
@Thickness 0.0630 in
Stufe; IEC 707
 HB
@Thickness 3.20 mm
HB
@Thickness 0.126 in
Stufe; IEC 707
 
Processing PropertiesMetricEnglishComments
Melt Temperature 265 - 295 °C509 - 563 °F
Mold Temperature 70.0 - 100 °C158 - 212 °F
 
Descriptive Properties
Back PressureLow
Holding PressureHigh
Injection SpeedHigh
Screw SpeedMedium

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