Advantages & Application Notes:

• Reasonable pot-life that allows for low temperature curing to be realized. It has an amber color change upon cure.
• Passes NASA low outgassing standard ASTM E595 with proper cure
• Semiconductor suggested applications: wafer-wafer bonding of CSP; fabrication of MEMs devices; flip chip underfill.
• Hybrid suggested applications: providing near hermetic seals and UHV seals in sensor devices, resisting high temperature packaging
  • Down-Hole petrochemical fiber optic sensors, resisting >200°C field conditions
• Fiber optic adhesive designed to meet Telecordia 1221 - suggested applications:
  • Sealing fiber into ferrules, transmitting light in the optical pathway from 800- 1550 nm range
  • Fiber component packaging; adhesive for active alignment of optics, environmental seal of opto-package, V-groove arrays
• Medical suggested applications:
  • Potting fiber optic bundles into ferrules for light guides and endoscopes; capable of resisting several sterilization techniques including ETO, gamma, ION beam, H202 plasma, and >200 autoclave steam cycles; excellent adhesion to surfaces including SST, diamond, titanium, brass, ceramics, glass and most plastics.
  • Adhesive for catheter devices including stents and guide wires.
  • Certified to USP Class VI and ISO 10993 biocompatibility standards for medical implants.
  • Compatible with CIDEX® OPA sterilization.
• Electronics Assembly suggested applications:
  • Used as dielectric layer in the fabrication of capacitors; laminating PZT ferroelectrics found in ultrasound or ink-jetting devices
  • Impregnating and insulating copper coil windings in motors and inductor coils. Bonding ferrite cores and magnets.
  • Structural grade epoxy found in hard-disk drive devices; bonding of SST metals, kapton, and magnets

Information Provided by Epoxy Technology