Epoxy Potting and Encapsulating Systems for Electronic Applications High technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive and related industries.
Cytec (Conap) FR-1047 / EA-02 Conapoxy® Resin / Conacure® Hardener Flame retardant (UL 94V-0), non-abrasive epoxy system. It has excellent resistance to thermal shock, low exotherm, and good electrical properties typified by very good arc resistance.
- Mix Ratio, Resin/Hardener (by weight): 100/4.5
Cure Type: Room Temperature Information provided by Cytec, subsequently acquired by Elantas. |