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Chemically Resistant adhesives

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Epoxy Technology EPO-TEK® H22 Electrically Conductive, Silver Epoxy
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy, Electrically Conductive
Material Notes: Product Description: EPO-TEK® H22 is a two component, silver-filled epoxy system designed specifically for die bonding and sealing hybrid circuit packages.

Advantages & Application Notes:

  • A smooth, free flowing, slightly thixotropic paste, using a 100% solids system. It can be dispensed, screen printed, or manually applied.
  • High Tg allows it to be used for high temperature applications.
  • Outstanding high temperature properties and excellent solvent, chemical and moisture resistance.
  • Extended pot life and fast curing at relatively low temperatures < 100°C.
  • Designed to be used in the 300°C range for applications such as wire bonding operations and eutectic lid-sealing processes.
  • Contains no solvents or thinners. Passes NASA low outgassing standard ASTM E595 with proper cure
  • Can be used instead of eutectic solders for near-hermetic sealing.

Information Provided by Epoxy Technology
Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Specific Gravity 1.03 g/ccPart B
 2.03 g/ccPart A
Particle Size <= 45 µm
Viscosity 12000 - 20000 cP
@Temperature 23.0 °C		20 rpm
 
Chemical PropertiesOriginal ValueComments
Ionic Impurities - Na (Sodium) 60 ppm
Ionic Impurities - K (Potassium) 6.0 ppm
Ionic Impurities - Cl (Chloride) 175 ppm
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 80
Tensile Modulus 540120 psiStorage
Shear Strength >= 1700 psiDie
 1980 psiLap
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity <= 0.00050 ohm-cm
 
Thermal PropertiesOriginal ValueComments
CTE, linear 39.0 µm/m-°CBelow Tg
 224 µm/m-°CAbove Tg
Thermal Conductivity 0.940 W/m-K
Maximum Service Temperature, Air 250 °CContinuous
 350 °CIntermittent
Minimum Service Temperature, Air -55.0 °CContinuous
 -55.0 °CIntermittent
Glass Transition Temp, Tg >= 100 °CDynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Decomposition Temperature 454 °CDegradation Temperature
 
Processing PropertiesOriginal ValueComments
Cure Time 5.00 min
@Temperature 150 °C		Minimum Bond Line
 10.0 min
@Temperature 120 °C		Minimum Bond Line
 20.0 min
@Temperature 100 °C		Minimum Bond Line
Pot Life 960 min
Shelf Life 12.0 Month
@Temperature 25.0 °C
 
Descriptive Properties
ColorAmberPart B
 SilverPart A
ConsistencySmooth flowing paste
Ionic Impurities NH4148 ppm
Mix Ratio by Weight100:4.5
Number of ComponentsTwo
Thixotropic Index2.36
Weight Loss0.09%200°C
 0.23%250°C
 0.42%300°C

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PPOXYT038 / 141077

Chemically Resistant adhesives




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