| Description: Primerless Thermabond®: Electrically insulating, thermally conductive, electronic adhesive. Bonds without primer. Design/Construction:
Liner: FEP
Product: Uncured Silicone Rubber
Carrier: PTFE Coated Fiberglass Product Advatages:
Bond Reliability – Bonds securely regardless of substrate type, shape, or texture.
Hot Spot Elimination – Thermal conductivity up to 3 W/mK to transport heat away from hot spots.
Thermal-Mechanical Stress Decoupling – Low modulus and high shear strength prevent adhesive delamination.
Low Temperature Cure Cycle – Thermabond® cure parameters can be as low as 100°C at 100 kPa, so surface mount components can be mounted on the PCB prior to bonding.
Uniform Bond Line Thickness – Precision calendering produces a uniform adhesive film.
Proven Performance – Arlon Thermabond® adhesive products are the gold standard for critical, demanding electronic system applications. Product Use: Electrically insulating electronic adhesive. Bonds without primer. Appearance: Gray, High viscosity gum on fluoropolymer release liners This data represents typical values for the production material. The data should not be used to write, or in place of, material specifications. Information provided by Arlon Silicone Technologies Division; now a part of Rogers Corporation. |
