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Metal adhesives

Resinlab® EP1290 Gray Mineral Filled Epoxy Adhesive
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy Adhesive

Material Notes: Resinlab™ EP1290 Gray is a two part mineral filled epoxy adhesive designed for bonding metals and plastics. It cures at room temperature to a tough, semi-flexible material. It has good wetting to most surfaces and is free flowing to penetrate cavities and give good self leveling and air release. This product gives very good vibration and impact resistance. It gives good resistance to water, salt spray, inorganic acids and bases and most organic solvents. It was especially formulated to a 1A:1B volume mix ratio for use in side-by-side dispensing cartridges and meter/mix and dispense equipment. EP1290 Gray will reach handle cure at room temperature within 16 – 24 hours. Cure time can be accelerated by the application of heat. Times and temperatures from 2 hours at 65°C to 20 minutes at 100°C are typical for most applications. Time to heat substrate must be taken into account. Cooler temperatures will also extend work time and increase cure times.

Information Provided by Resinlab L.L.C., an Ellsworth Adhesives Company.

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Physical PropertiesMetricEnglishComments
Specific Gravity 1.35 g/cc1.35 g/ccPart B; TM R050-16
 1.36 g/cc1.36 g/ccMixed; TM R050-16
 1.37 g/cc1.37 g/ccPart A; TM R050-16
Water Absorption 0.17 %
@Time 86400 sec
0.17 %
@Time 24.0 hour
TM R050-35
Viscosity 7500 cP7500 cPPart B, RVT, #7, 2.5 rpm; TM R050-12
 30000 cP30000 cPMixed; TM R050-12
 50000 cP50000 cPPart A, RVT, #7, 2.5 rpm; TM R050-12
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore D 6060TM R050-17
Tensile Strength at Break 11.0 MPa1600 psiTM R050-36
Tensile Strength, Ultimate 11.0 MPa1600 psiTM R050-36
Tensile Strength, Yield 1.38 MPa200 psiTM R050-36
Elongation at Break 40 - 50 %40 - 50 %TM R050-36
Tensile Modulus 0.0345 - 0.0689 GPa5.00 - 10.0 ksiTM R050-36
Compressive Yield Strength 13.8 MPa2000 psiTM R050-38
Compressive Strength 134 MPa19500 psiBreak; TM R050-38
 138 MPa20000 psiUltimate; TM R050-38
Compressive Modulus 0.0896 - 0.124 GPa13.0 - 18.0 ksiTM R050-38
Adhesive Bond Strength 17.2 MPa2500 psiLap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 5.00e+12 ohm-cm5.00e+12 ohm-cm
Dielectric Constant 6.5
@Frequency 100 Hz,
Temperature 25.0 °C
6.5
@Frequency 100 Hz,
Temperature 77.0 °F
Dielectric Strength 33.5 kV/mm850 kV/in
 
Thermal PropertiesMetricEnglishComments
CTE, linear  86.0 µm/m-°C
@Temperature <=31.0 °C
47.8 µin/in-°F
@Temperature <=87.8 °F
below Tg
 166 µm/m-°C
@Temperature >=31.0 °C
92.2 µin/in-°F
@Temperature >=87.8 °F
above Tg
Thermal Conductivity 0.140 W/m-K0.972 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 150 °C302 °F
Minimum Service Temperature, Air -40.0 °C-40.0 °F
Glass Transition Temp, Tg 31.0 °C87.8 °FTM R050-25
 
Processing PropertiesMetricEnglishComments
Pot Life >= 120 min>= 120 minMass: 50g; TM R050-19
 
Descriptive Properties
ColorGray
Mix Ratio1:1Weight and Volume

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PRESL127 / 101541

Metal adhesives

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