Asahi Kasei Leona™ 1500 Polyamide 66, High Molecular Weight

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Asahi Kasei Leona™ 1500 Polyamide 66, High Molecular Weight
Categories:	Polymer; Thermoplastic; Nylon (Polyamide PA); Nylon 66 (PA66); Nylon 66, Unreinforced
Material Notes:	Improved mechanical properties due to increased molecular weight. Applications:Fasteners, sheets Information provided by Asahi Kasei Corp.
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Physical Properties	Original Value	Comments

Specific Gravity	1.14 g/cc	Dry as Molded; ASTM D792
Moisture Absorption at Equilibrium	2.5 % @Temperature 23.0 °C	50% RH
Linear Mold Shrinkage, Flow	0.013 - 0.020 cm/cm	Asahi Kasei

Mechanical Properties	Original Value	Comments
Hardness, Rockwell M	55	Conditioned at 50% RH; ASTM D785
	80	Dry as Molded; ASTM D785
Hardness, Rockwell R	105	Conditioned; ASTM D 785
	120	Dry as Molded; ASTM D 785
Tensile Strength	57.0 MPa	Conditioned at 50% RH; ASTM D638
	79.0 MPa	Dry as Molded; ASTM D638
Elongation at Break	80 %	Dry as Molded; ASTM D638
	270 %	Conditioned at 50% RH; ASTM D638
Flexural Strength	54.0 MPa	Conditioned at 50% RH
	118 MPa	Dry as Molded
Flexural Modulus	1200 MPa	Conditioned at 50% RH; ASTM D790
	2800 MPa	Dry as Molded; ASTM D790
Izod Impact, Notched	49.0 J/m	Dry as Molded; ASTM D256
	176 J/m	Conditioned at 50% RH; ASTM D256
Taber Abrasion, mg/1000 Cycles	5.0	Conditioned at 50% RH; ASTM D1044

Electrical Properties	Original Value	Comments
Volume Resistivity	1.00e+15 ohm-cm	ASTM D257
Surface Resistance	1.00e+14 ohm	Dry as Molded; ASTM D257
Dielectric Strength	20.0 kV/mm	Dry as Molded; ASTM D149

Thermal Properties	Original Value	Comments
CTE, linear	80.0 µm/m-°C	Dry as Molded; ASTMD 696
Specific Heat Capacity	1.67 J/g-°C	Dry as Molded
Thermal Conductivity	0.200 W/m-K	Dry as Molded
Deflection Temperature at 0.46 MPa (66 psi)	230 °C	Dry as Molded; ASTM D648
Deflection Temperature at 1.8 MPa (264 psi)	70.0 °C	Dry as Molded; ASTM D 648

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PASAHI8124 / 221151

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