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Metal adhesives

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Momentive Performance Materials SilCool™ LTR3292 Low Thermal Resistance Silicone Adhesive
Categories: Polymer; Adhesive; Thermoset; Silicone; Silicone, RTV, Adhesive/Sealant Grade

Material Notes: SilCool LTR3292 silicone adhesive is a one-component, low viscosity, thermally conductive material, which will remain in a liquid, uncured state at room temperature and cures to an elastomer when heat is applied. SilCool LTR3292 silicone adhesive provides much higher thermal conductivity than conventional silicone adhesives; making it suitable for use in electrical and electronic applications where thermal management & high heat transfer is critical. Utilizing a specially developed filler technology, SilCool LTR3292 is capable of achieving a reduced bond line thickness and has very low thermal resistance values. It is non-corrosive to metals and has excellent adhesive properties to a wide variety of substrates, including ceramics, glass, and most metals, including aluminum, copper and nickel plate. In addition, it also offers excellent adhesion to a broad range of high performance thermoplastics, such as PPS and PBT.

Key Performance Properties:

  • Excellent thermal conductivity properties
  • Very low thermal resistance
  • Reduced bond line thickness capability (< 2 mils)
  • Heat accelerated cure, one component, to increase productivity
  • Primerless adhesion eliminates mechanical fastening
  • Outstanding long-term performance under high humidity

GE Silicones became a part of Momentive Performance Materials in 2006.

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Physical PropertiesOriginal ValueComments
Specific Gravity 2.62 g/cc
@Temperature 23.0 °C
Viscosity 12000 cP10.0/s, CSL2500 Rheometer
Brookfield Viscosity 30000 cP
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore A 83
Tensile Strength at Break 2.60 MPa
Elongation at Break 40 %
Adhesive Bond Strength 140 psiAluminum lap shear, 1" overlap at 0.125" thickness, 30 min. at 150°C
 450 psiDie shear, Si die to aluminum shear, 2 hrs. at 150°C
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 4.60e+15 ohm-cm
Dielectric Constant 6.2
@Frequency 1000 Hz
Dielectric Strength 17.4 kV/mm
Dissipation Factor 0.0020
@Frequency 1000 Hz
 
Thermal PropertiesOriginal ValueComments
Thermal Conductivity 1.56 W/m-KBulk
 
Descriptive Properties
ColorGray
ConsistencyFlowable
Ionic content<5ppmNa+,K+,Cl+, uncured samples
Thermal Resistance28 mm2K/Wat 23°C

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PGESIL065 / 41056

Metal adhesives

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