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Master Bond adhesives

Rogers Arlon AD350A PTFE/Woven Fiberglass/Ceramic Filled Composite
Categories: Polymer; Thermoplastic; Fluoropolymer; Polytetrafluoroethylene (PTFE)
Material Notes:
  • Tighter Dielectric Tolerance
  • Low Z-Axis Thermal Expansion
  • Ceramic Filled PTFE
  • High Thermal Conductivity
  • Large Panel Size

Benefits:

  • Higher Consistency of Performance
  • Superior PTH Adhesion
  • Heat Dissipation and Management
  • Multiple boards per panel; Larger Printed Circuit Board formats

Typical Applications:

  • High Power Applications
  • Low Noise Amplifiers (LNAs)
  • Low Noise Blocks (LNBs)
  • Filters and Couplers

Information provided by Arlon Materials for Electronics (MED); now a part of Rogers Corporation.
Vendors: Arlon Materials for Electronics (MED) is a major manufacturer of specialty high performance laminate and prepreg materials for use in a wide variety of printed circuit board (PCB) applications and in several distinctive markets.

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Physical PropertiesMetricEnglishComments
Density 2.10 g/cc0.0759 lb/in³ASTM D792 Method A
Water Absorption 0.10 %0.10 %IPC TM-650 2.6.2.2
Outgassing - Total Mass Loss  0.00 %
@Pressure <=1.33e-10 MPa,
Temperature 125 °C		0.00 %
@Pressure <=1.93e-8 psi,
Temperature 257 °F		Water Vapor Recovered; NASA SP-R-0022A
 0.020 %
@Pressure <=1.33e-10 MPa,
Temperature 125 °C		0.020 %
@Pressure <=1.93e-8 psi,
Temperature 257 °F		NASA SP-R-0022A
Collected Volatile Condensable Material 0.020 %
@Pressure <=1.33e-10 MPa,
Temperature 125 °C		0.020 %
@Pressure <=1.93e-8 psi,
Temperature 257 °F		NASA SP-R-0022A
 
Mechanical PropertiesMetricEnglishComments
Tensile Strength >= 138 MPa>= 20000 psiIPC TM-650 2.4.18
Modulus of Elasticity >= 4.83 GPa>= 700 ksiASTM D638
Flexural Modulus >= 3.72 GPa>= 540 ksiASTM D790
Compressive Modulus >= 2.41 GPa>= 350 ksiASTM D695
Peel Strength 2.63 kN/m15.0 pliTo Copper (1/2 oz.); A, TS; IPC TM-650 2.4.8
 2.98 kN/m17.0 pliTo Copper (1 oz.); A, TS; IPC TM-650 2.4.8
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 1.20e+15 ohm-cm1.20e+15 ohm-cmC96/35/90; IPC TM-650 2.5.17.1
Surface Resistance 4.50e+13 ohm4.50e+13 ohmC96/35/90; IPC TM-650 2.5.17.1
Dielectric Constant 3.45 - 3.55
@Frequency 1e+10 Hz		3.45 - 3.55
@Frequency 1e+10 Hz		C23/50; IPC TM-650 2.5.5.5
Dielectric Breakdown >= 45000 V>= 45000 VD48/50; ASTM D149
Dissipation Factor 0.0030
@Frequency 1e+10 Hz		0.0030
@Frequency 1e+10 Hz		C23/50; IPC TM-650 2.5.5.5
Arc Resistance >= 180 sec>= 180 secD48/50; IPC TM-650 2.5.1B
 
Thermal PropertiesMetricEnglishComments
CTE, linear  5.00 µm/m-°C
@Temperature 0.000 - 100 °C		2.78 µin/in-°F
@Temperature 32.0 - 212 °F		x direction; IPC TM-650 2.4.24
 9.00 µm/m-°C
@Temperature 0.000 - 100 °C		5.00 µin/in-°F
@Temperature 32.0 - 212 °F		y direction; IPC TM-650 2.4.24
CTE, linear, Transverse to Flow 35.0 µm/m-°C
@Temperature 0.000 - 100 °C		19.4 µin/in-°F
@Temperature 32.0 - 212 °F		z direction; IPC TM-650 2.4.24
Thermal Conductivity 0.450 W/m-K
@Temperature 100 °C		3.12 BTU-in/hr-ft²-°F
@Temperature 212 °F		ASTM E1225
Flammability, UL94 V-0V-0Vertical Burn
 
Descriptive Properties
Temperature Coefficient of Dielectric (ppm/°C)-55IPC TM-650 2.5.5.5; at 10 GHz (-40 - 150°C)

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PARLM9887 / 149040




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