LNP THERMOCOMP EC006E compound is based on Polyetherimide (PEI) resin containing 30% carbon fiber. Added features of this grade include: Easy Molding, Electrically Conductive. Features: High Stiffness,Light-weight Structural,High Heat Resistance,Super Strong (Carbon Fiber Filled),Electrically Conductive,Easy Molding,Structural Information provided by SABIC |