SABIC LNP™ COLORCOMP™ Compound N1000EXB Polycarbonate + ABS (PC+ABS)

Login to see your most recently viewed materials here. Or if you don't have an account with us yet, then click here to register.

USP Class VI Approved Adhesives for Medical Device Applications
Master Bond’s biocompatible adhesives are designed to meet the needs of medical device manufacturers. Compounds withstand various types of sterilization methods.

(Viewing data as-entered. Click here to return)

SABIC LNP™ COLORCOMP™ Compound N1000EXB Polycarbonate + ABS (PC+ABS)
Categories:	Polymer; Thermoplastic; ABS Polymer; Polycarbonate/ABS Alloy, Unreinforced
Material Notes:	LNP COLORCOMP N1000EXB compound is based on unfilled Polycarbonate/Acrylonitrile Butadiene Styrene (PC/ABS) blend. Added features of this grade include: Good Flow and Excellent Impact, Healthcare, Low Extractables, Biocompatible (ISO10993 or USP Class VI). Features: Low Extractable,Aesthetics and Appearance,Healthcare,Easy Flow,Custom Color,High Impact Resistance,Food Contact Acceptable,Biocompatible Information provided by SABIC
Vendors:	No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
Printer friendly version Download as PDF Download to Excel (requires Excel and Windows) Export data to your CAD/FEA program Add to Folder:

Physical Properties	Original Value	Comments

Specific Gravity	1.15 g/cc	ASTM D792
Density	1.15 g/cc	ISO 1183
Moisture Absorption	0.0200 %	Injection Molding
	0.200 %	23°C / 50% RH; ISO 62
Water Absorption at Saturation	0.60 %	ISO 62-1
Viscosity	8.0 cP @Load 2.16 kg, Temperature 260 °C	MVR cc/10 min; ISO 1133
	22 cP @Load 5.00 kg, Temperature 260 °C	MVR cc/10 min; ISO 1133
Linear Mold Shrinkage, Flow	0.0050 - 0.0070 cm/cm	SABIC method
	0.0050 - 0.0070 cm/cm @Thickness 3.20 mm	SABIC method
Melt Flow	24 g/10 min @Load 5.00 kg, Temperature 260 °C	ASTM D1238

Mechanical Properties	Original Value	Comments
Hardness, Rockwell R	115	ISO 2039-2
Ball Indentation Hardness	96.0 MPa	H358/30; ISO 2039-1
Tensile Strength at Break	45.0 MPa	5 mm/min; ISO 527
	45.0 MPa	50 mm/min; ISO 527
	47.0 MPa	50 mm/min; ASTM D638
Tensile Strength, Yield	55.0 MPa	5 mm/min; ISO 527
	55.0 MPa	50 mm/min; ISO 527
	57.0 MPa	50 mm/min; ASTM D638
Elongation at Break	>= 50 %	50 mm/min; ISO 527
	100 %	50 mm/min; ASTM D638
	100 %	5 mm/min; ISO 527
Elongation at Yield	4.0 %	50 mm/min; ISO 527
	5.0 %	50 mm/min; ASTM D638
	5.0 %	5 mm/min; ISO 527
Tensile Modulus	2270 MPa	5 mm/min; ASTM D638
	2400 MPa	1 mm/min; ISO 527
Flexural Strength	80.0 MPa	yield, 2 mm/min; ISO 178
	88.0 MPa	yld, 1.3 mm/min, 50 mm span; ASTM D790
Flexural Modulus	2300 MPa	1.3 mm/min, 50 mm span; ASTM D790
	2300 MPa	2 mm/min; ISO 178
Izod Impact Notched	580 J	ASTM D256
	480 J @Temperature -30.0 °C	ASTM D256
Izod Impact, Notched (ISO)	50.0 kJ/m²	80103; ISO 180/1A
	30.0 kJ/m² @Temperature -30.0 °C	80103; ISO 180/1A
Charpy Impact, Notched	50.0 kJ/m²	Edgew 80103 sp=62mm; ISO 179/1eA
	30.0 kJ/m² @Temperature -30.0 °C	Edgew 80103 sp=62mm; ISO 179/1eA
Dart Drop, Total Energy	54.0 J	ASTM D3763
Taber Abrasion, mg/1000 Cycles	63	CS-17, 1 kg; ASTM D1044

Electrical Properties	Original Value	Comments
Volume Resistivity	>= 1.00e+15 ohm-cm	IEC 60093
Surface Resistance	>= 1.00e+15 ohm	ROA; IEC 60093
Dielectric Constant	2.7 @Frequency 1e+6 Hz	IEC 60250
	2.8 @Frequency 50.0 - 60.0 Hz	IEC 60250
Dielectric Strength	17.0 kV/mm @Thickness 3.20 mm	in oil; IEC 60243-1
	25.0 kV/mm @Thickness 1.60 mm	in oil; IEC 60243-1
	35.0 kV/mm @Thickness 0.800 mm	in oil; IEC 60243-1
Dissipation Factor	0.0020 @Frequency 50.0 - 60.0 Hz	IEC 60250
	0.0070 @Frequency 1e+6 Hz	IEC 60250
Comparative Tracking Index	250 V	IEC 60112
	250 - 400 V	UL 746A
Hot Wire Ignition, HWI	15 - 30 sec @Thickness >=1.20 mm	UL 746A
High Amp Arc Ignition, HAI	60 - 120 arcs @Thickness >=1.20 mm	UL 746A

Thermal Properties	Original Value	Comments
CTE, linear, Parallel to Flow	72.0 µm/m-°C @Temperature -40.0 - 40.0 °C	ASTM E831
	80.0 µm/m-°C @Temperature 23.0 - 60.0 °C	ISO 11359-2
CTE, linear, Transverse to Flow	72.0 µm/m-°C @Temperature -40.0 - 40.0 °C	ASTM E831
	80.0 µm/m-°C @Temperature 23.0 - 60.0 °C	ISO 11359-2
Thermal Conductivity	0.200 W/m-K	ISO 8302
Hot Ball Pressure Test	125 °C	PASS; IEC 60695-10-2
Deflection Temperature at 0.46 MPa (66 psi)	122 °C	Edgew 120104 sp=100mm; ISO 75/Be
Deflection Temperature at 1.8 MPa (264 psi)	102 °C	Edgew 120104 sp=100mm; ISO 75/Ae
	112 °C @Thickness 3.20 mm	unannealed; ASTM D648
Vicat Softening Point	126 °C	Rate B/50; ISO 306
	128 °C	Rate B/120; ISO 306
	130 °C	Rate B/50; ASTM D1525
UL RTI, Electrical	105 °C	UL 746B
UL RTI, Mechanical with Impact	80.0 °C	UL 746B
UL RTI, Mechanical without Impact	105 °C	UL 746B
Flammability, UL94	HB @Thickness >=0.750 mm	UL 94
Oxygen Index	23 %	ISO 4589
Glow Wire Ignition Temperature	725 °C @Thickness 3.50 mm	IEC 60695-2-13
Glow Wire Flammability Index	960 °C @Thickness 3.50 mm	IEC 60695-2-12

Processing Properties	Original Value	Comments
Nozzle Temperature	240 - 280 °C
Zone 2	250 - 290 °C
Zone 3	250 - 290 °C
Melt Temperature	260 - 290 °C	Injection Molding
Mold Temperature	60.0 - 90.0 °C
Drying Temperature	100 - 110 °C	Injection Molding
Dry Time	2.00 - 4.00 hour	Injection Molding
Precipitation Temperature	60.0 - 80.0 °C	Hopper Temperature

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to go back to viewing the property data in MatWeb's normal format.

PSABH80569 / 288516

	Advertise with MatWeb!
	Data sheets for over 180,000 metals, plastics, ceramics, and composites.
	HOME • SEARCH • TOOLS • SUPPLIERS • FOLDERS • ABOUT US • FAQ • LOG IN

System Message