DAI-EL® G-671 is a bisphenol cure incorporated terpolymer designed for transfer and compression molding applications. G-671 combines good chemical and solvent resistance with good low temperature properties. Typical Applications: O-rings, gaskets, seals Rheological Properties MDR 2000: Temperature: 190°C Frequency: 100 cpm Strain: 0.5° Test time: 6 min Information provided by Daikin. |