Epoxy Technology EPO-TEK® 360 Low Viscosity Optical Epoxy Adhesive

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Epoxy Technology EPO-TEK® 360 Low Viscosity Optical Epoxy Adhesive
Categories:	Polymer; Thermoset; Epoxy
Material Notes:	Product Description: EPO-TEK® 360 is a two component, high-temperature grade epoxy for semiconductor, electronics, fiber optics and medical applications. Advantages & Application Notes: Built in color change from clear to amber when cured properly. The color change can be used for in-line inspection of epoxy joints and adhesive fillet. Unfilled epoxy resin allows for % transmission in the VIS and NIR to be realized. Low viscosity allows for wicking and capillary action. Suggested Applications: Semiconductor: capillary flow underfill for Flip Chip mounted die Fiber Optic: polarizing maintaining fibers ( PMF ) found in gyroscope coils; fiber termination into ferrule. Medical: impregnation into fiber optic light guides and endoscopes; resist autoclave, ETO, or gamma sterilization. Electronics: impregnating copper coil windings found in motors or SMD inductor coils; adhesion to ferrite cores Featured inside Technical Paper #11 titled ?Significance of Glass Transition Temperature on Epoxy Resins for Fiber Optic Applications” Information Provided by Epoxy Technology
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Physical Properties	Original Value	Comments

Specific Gravity	1.02 g/cc	Part B
	1.15 g/cc	Part A
Viscosity	350 - 550 cP @Temperature 23.0 °C	100 rpm

Mechanical Properties	Original Value	Comments
Hardness, Shore D	87
Tensile Modulus	322000 psi	Storage
Shear Strength	>= 2000 psi	Lap
	>= 3400 psi	Die

Electrical Properties	Original Value	Comments
Volume Resistivity	<= 2.00e+13 ohm-cm
Dielectric Constant	3.74 @Frequency 1000 Hz
Dissipation Factor	0.011 @Frequency 1000 Hz

Thermal Properties	Original Value	Comments
CTE, linear	39.0 µm/m-°C	Below Tg
	175 µm/m-°C	Above Tg
Maximum Service Temperature, Air	200 °C	Continuous
	300 °C	Intermittent
Minimum Service Temperature, Air	-55.0 °C	Continuous
	-55.0 °C	Intermittent
Glass Transition Temp, Tg	>= 90.0 °C	Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
Decomposition Temperature	375 °C	Degradation Temperature

Optical Properties	Original Value	Comments
Refractive Index	1.5345 @Wavelength 589 nm
Transmission, Visible	>= 51 % @Wavelength 500 nm	Spectral
	>= 88 % @Wavelength 600 nm	Spectral
	>= 97 % @Wavelength 700 - 1600 nm	Spectral

Processing Properties	Original Value	Comments
Cure Time	1.00 min @Temperature 150 °C	Minimum Bond Line
	10.0 min @Temperature 100 °C	Minimum Bond Line
Pot Life	360 min
Shelf Life	12.0 Month @Temperature 25.0 °C

Descriptive Properties
Color	Amber	Part B
	Clear/Colorless	Part A
Consistency	Pourable liquid
Mix Ratio by Weight	100:10
Number of Components	Two
Weight Loss	0.08%	200°C
	0.25%	250°C
	1.06%	300°C

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PPOXYT145 / 141184

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