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Master Bond adhesives

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BASF Ultrason® E 2010 PES
Categories: Polymer; Thermoplastic; Polyethersulfone (PES)

Material Notes: Ultrason E 2010 is an unreinforced, medium viscosity standard injection molding PES grade. It flows readily and offers outstanding heat resistance and dimensional stability. It conforms to FDA requirements of 21 CFR 177.2440.

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Physical PropertiesOriginal ValueComments
Density 1.37 g/ccISO 1183
Water Absorption 2.2 %ISO 62
Moisture Absorption at Equilibrium 0.80 %23°C/50% R.H.; ISO 62
Viscosity Number 56 cm³/g
Linear Mold Shrinkage, Flow 0.0082 cm/cmISO 294
Linear Mold Shrinkage, Transverse 0.0086 cm/cmISO 294
Melt Flow 70 g/10 min
@Load 10.0 kg,
Temperature 360 °C
ISO 1133
 
Mechanical PropertiesOriginal ValueComments
Ball Indentation Hardness 154 MPaISO 2039-1
Tensile Strength at Break 90.0 MPa5mm/min; ISO 527-2
Tensile Strength, Yield 90.0 MPa50mm/min; ISO 527-2
Elongation at Break 6.7 %5mm/min; ISO 527-2
Elongation at Yield 6.7 %50mm/min; ISO 527-2
Modulus of Elasticity 2.50 GPa
@Temperature 60.0 °C
ISO 527
Tensile Modulus 2700 MPaISO 527-2
Flexural Strength 131 MPaISO Data
Flexural Modulus 2600 MPaASTM Test
 2860 MPaISO Data
Fatigue Strength 5.00 MPa
@# of Cycles 1.00e+7 ,
Temperature 180 °C
 7.00 MPa
@# of Cycles 1.00e+6 ,
Temperature 180 °C
 9.00 MPa
@# of Cycles 100000 ,
Temperature 180 °C
 12.0 MPa
@# of Cycles 10000 ,
Temperature 180 °C
 22.0 MPa
@# of Cycles 1.00e+7
 25.0 MPa
@# of Cycles 100000
 35.0 MPa
@# of Cycles 100000
 55.0 MPa
@# of Cycles 10000
Shear Modulus 0.200 GPa
@Temperature 225 °C
ISO 6721
 0.900 GPa
@Temperature 200 °C
ISO 6721
 0.950 GPa
@Temperature 100 °C
ISO 6721
 1.00 GPa
@Temperature 50.0 °C
ISO 6721
Izod Impact, Notched (ISO) 6.50 kJ/m²ISO 180/A
 7.00 kJ/m²
@Temperature -30.0 °C
ISO 180/A
Charpy Impact Unnotched NBISO 179/1eU
 NB
@Temperature -30.0 °C
ISO 179/1eU
Charpy Impact, Notched 0.650 J/cm²ISO 179/1eA
 0.700 J/cm²
@Temperature -30.0 °C
ISO 179/1eA
Tensile Creep Modulus, 1000 hours 2700 MPaelongation <0.5%, 23°C; ISO 899
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity >= 1.00e+13 ohm-cmIEC 60093
Surface Resistance >= 1.00e+14 ohmIEC 60093
Dielectric Constant 3.8
@Frequency 1e+6 Hz
IEC 60250
 3.9
@Frequency 100 Hz
IEC 60250
Dielectric Strength 37.0 kV/mmIEC 60243-1
Dissipation Factor 0.0017
@Frequency 100 Hz
IEC 60250
 0.014
@Frequency 1e+6 Hz
IEC 60250
Comparative Tracking Index 125 VTest Liquid A & B; IEC 60112
 
Thermal PropertiesOriginal ValueComments
CTE, linear 50.0 µm/m-°C
@Temperature -26.0 °C
DIN 53752
 54.0 µm/m-°C
@Temperature 75.0 °C
DIN 53752
 60.0 µm/m-°C
@Temperature 175 °C
DIN 53752
CTE, linear, Parallel to Flow 52.0 µm/m-°CISO 11359-1/-2
 59.0 µm/m-°CISO 11359-1/-2
Specific Heat Capacity 1.00 J/g-°C
Thermal Conductivity 0.190 W/m-KDIN 52612-1
Maximum Service Temperature, Air 220 °C
Deflection Temperature at 0.46 MPa (66 psi) 218 °CISO 75-2
Deflection Temperature at 1.8 MPa (264 psi) 205 °CISO 75-2
Glass Transition Temp, Tg 225 °CISO 11357-1/-3
UL RTI, Electrical 190 °C50% decrease of tensile strength after 20000h; 746B
Flammability, UL94 V-0
@Thickness 3.20 mm
 V-0
@Thickness 1.60 mm
 5VA
@Thickness >=3.00 mm
Oxygen Index 38 %ISO 4589-1/-2
Glow Wire Ignition Temperature 825 °CIEC 60695-2-13
Glow Wire Flammability Index 960 °CIEC 60695-2-12
 
Optical PropertiesOriginal ValueComments
Refractive Index 1.65
Transmission, Visible 88 %
@Thickness 50.8 mm
ASTM D 1003
 30 %
@Wavelength 350 nm
 72 %
@Wavelength 400 nm
 81 %
@Wavelength 500 nm
 85 %
@Wavelength 600 nm
UV Transmittance 2.0 %
@Wavelength 300 nm
 15 %
@Wavelength 200 nm
 
Processing PropertiesOriginal ValueComments
Melt Temperature 340 - 390 °CInjection molding
Mold Temperature 140 - 180 °CInjection molding
 
Compliance PropertiesOriginal ValueComments
FDA Yes21 CFR 177.2440
NSF YesNSF Std. 51
 YesNSF Std. 61
 
Descriptive Properties
ColorNatural and colored
Commercial StatusNorth America and Europe
Impact ModifiedNo
Primary Processing TechniqueInjection Molding, Extrusion, and Blow Molding

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